Abstract: A package substrate includes a core layer, at least one functional component, at least one spacer, a filler, a first and a second build-up structures. The core layer has at least one opening and multiple conductive through vias. The functional component is disposed in the openings. The spacer is disposed on the functional component. The filler is filled in the opening, covering the functional component and spacer, and completely filling the gap between the opening, the functional component and the spacer. The first build-up structure is disposed on a first surface of the core layer and a third surface of the filler, and electrically connected to the functional component and the conductive through vias. The second build-up structure is disposed on a second surface of the core layer and a fourth surface of the filler, contacts the spacer and electrically connected to the conductive through vias.

Abstract: An ingot edge-polishing machine tool includes a case body, a support base, a first limiting assembly, a second limiting assembly, a polishing assembly, and an ingot fixing assembly. The support base is movably disposed on the case body along a first axis. The first limiting assembly is detachably disposed on the case body. The first limiting assembly is configured to limit a position of the support base on the first axis. The polishing assembly is movably disposed above the support base along the first axis. The second limiting assembly is detachably disposed on the case body. The second limiting assembly is configured to limit a position of the polishing assembly on the first axis. The ingot fixing assembly is rotatably disposed around a second axis and located between the support base and the polishing assembly. The support base is adapted to support an ingot.

Abstract: A bicycle stand is provided, including: a first connecting portion, a main body and at least two supporting members. The first connecting portion is configured to be assembled to a frame of a bicycle. The main body includes a rod member and a base connected with the rod member, and the rod member defines an axial direction and includes a second connecting portion detachably connected with the first connecting portion. The at least two supporting members are connected with the base and respectively include at least one supporting surface configured to be abutted against a placement surface, and the at least two supporting members are movable relative to the main body between an expanding position and a folded position.

Abstract: A method for manufacturing an air curtain device includes steps of: a) providing a frame that includes two side wall bodies and two end wall bodies cooperatively defining an inner space thereamong, and an upper opening and a lower opening through which the inner space communicates with the external environment; b) covering an upper surface and a lateral outer surface of the frame with a first covering layer; c) closing the lower opening by placing an air-permeable plate; d) sealing a gap between the air-permeable plate and the frame by a first adhesive; e) removing a portion of the first covering layer that covers the upper surface of the frame; and f) closing the upper opening by a cover that is sealingly connected to the frame.

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Abstract: The present invention discloses a laminar flow device which includes a housing defining a cavity, at least one air inlet, a diffusion device and at least one uniform flow structure. The at least one air inlet is positioned within the housing. The diffusion device is positioned within the housing, and the at least one uniform flow structure is positioned within the bottom of the cavity.

Abstract: A control system of an electric bicycle includes is provided, including: a driving motor, a database and a control module. The driving motor includes a transmission module and at least one first sensor configured to sense at least one dynamic parameter of the transmission module. The database stores a plurality of riding mode information which respectively include a plurality of simulation parameters. The control module includes a setting unit, a computing unit and a control unit. The setting unit is configured to input at least one setting parameter, and the computing unit calculates a simulated moment of inertia and a calculation result data related to the simulated moment of inertia. The computing unit outputs at least one control signal according to the calculation result data, and the control unit receives the at least one control signal and controls a driving state of the driving motor accordingly.

Abstract: An ingot jig assembly is provided, including an end surface clamping jig and an ingot positioning jig. The end surface clamping jig includes two opposite clamping parts. The ingot positioning jig is located below the end surface clamping jig and includes a first base, an adjusting base, and two rollers. The adjusting base is located between the first base and the end surface clamping jig and is movably disposed on the first base along a first axis to be close to or away from the end surface clamping jig. The two rollers are rotatably disposed on the adjusting base. An ingot edge-polishing machine tool is also provided.

Abstract: A package carrier includes a substrate, at least one interposer disposed in at least one opening of the substrate, a conductive structure layer, a first build-up structure, and a second build-up structure. The interposer includes a glass substrate, at least one conductive via, at least one first pad, and at least one second pad. The conductive via passes through the glass substrate, and the first and the second pads are disposed respectively on an upper surface and a lower surface of the glass substrate opposite to each other and are connected to opposite ends of the conductive via. The conductive structure layer is disposed on the substrate and is structurally and electrically connected to the first and the second pads. The first and the second build-up structures are disposed respectively on the first and the second surfaces of the substrate and are electrically connected to the conductive structure layer.

Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.

Abstract: A method for manufacturing an air curtain device includes steps of: a) providing a frame that includes two side wall bodies and two end wall bodies cooperatively defining an inner space thereamong, and an upper opening and a lower opening through which the inner space communicates with the external environment; b) covering an upper surface and a lateral outer surface of the frame with a first covering layer; c) closing the lower opening by placing an air-permeable plate; d) sealing a gap between the air-permeable plate and the frame by a first adhesive; e) removing a portion of the first covering layer that covers the upper surface of the frame; and f) closing the upper opening by a cover that is sealingly connected to the frame.

Abstract: A package carrier includes a build-up circuit structure, a first insulation protective layer, a plurality of connection pads, and a plurality of metal balls. The build-up circuit structure has an upper surface. The first insulation protective layer is disposed on the upper surface of the build-up circuit structure and has a plurality of first openings. The connection pads are respectively disposed in the first openings of the first insulation protective layer and are structurally and electrically connected to the build-up circuit structure. Each of the connection pads has an arc-shaped groove. The metal balls are respectively disposed in the arc-shaped groove of the connection pads. The metal balls and the corresponding connection pads define a plurality of bump structures, and a plurality of top surfaces of the bump structures are on a same plane.

Abstract: A package carrier includes a substrate, at least one interposer disposed in at least one opening of the substrate, a conductive structure layer, a first build-up structure, and a second build-up structure. The interposer includes a glass substrate, at least one conductive via, at least one first pad, and at least one second pad. The conductive via passes through the glass substrate, and the first and the second pads are disposed respectively on an upper surface and a lower surface of the glass substrate opposite to each other and are connected to opposite ends of the conductive via. The conductive structure layer is disposed on the substrate and is structurally and electrically connected to the first and the second pads. The first and the second build-up structures are disposed respectively on the first and the second surfaces of the substrate and are electrically connected to the conductive structure layer.

Abstract: A package carrier includes a substrate, at least one interposer disposed in at least one opening of the substrate, a conductive structure layer, a first build-up structure, and a second build-up structure. The interposer includes a glass substrate, at least one conductive via, at least one first pad, and at least one second pad. The conductive via passes through the glass substrate, and the first and the second pads are disposed respectively on an upper surface and a lower surface of the glass substrate opposite to each other and are connected to opposite ends of the conductive via. The conductive structure layer is disposed on the substrate and is structurally and electrically connected to the first and the second pads. The first and the second build-up structures are disposed respectively on the first and the second surfaces of the substrate and are electrically connected to the conductive structure layer.

Abstract: A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.

Abstract: A circuit carrier board includes a first build-up layer structure, a substrate, an adhesive layer, and a conductive structure. The first build-up layer includes a plurality of first dielectric layers and a plurality of first circuit layers original stacked. The substrate includes a base and a second build-up layer structure disposed on the base. The second build-up layer structure includes a plurality of second dielectric layers and a plurality of second circuit layer original stacked. A top most layer of the second circuit layers is exposed outside of the second dielectric layers. The conductive structure penetrates through the first dielectric layers, the first circuit layers and the adhesive layer, and contacts with the top most layer of the second circuit layers. The conductive structure electrical connects the first circuit layers to the second circuit layers. A manufacturing method of the circuit carrier board is also provided.

Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.

Abstract: A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.

Abstract: A circuit carrier board includes a first build-up layer structure, a substrate, an adhesive layer, and a conductive structure. The first build-up layer includes a plurality of first dielectric layers and a plurality of first circuit layers original stacked. The substrate includes a base and a second build-up layer structure disposed on the base. The second build-up layer structure includes a plurality of second dielectric layers and a plurality of second circuit layer original stacked. A top most layer of the second circuit layers is exposed outside of the second dielectric layers. The conductive structure penetrates through the first dielectric layers, the first circuit layers and the adhesive layer, and contacts with the top most layer of the second circuit layers. The conductive structure electrical connects the first circuit layers to the second circuit layers. A manufacturing method of the circuit carrier board is also provided.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.