Abstract: An image sensor module has a light path, and includes an image sensor, a reflecting element, an optical multilayer deposition structure layer and a nano-rough surface. The image sensor corresponds to the light path. The reflecting element faces towards and is adjacent to the image sensor, and the reflecting element is configured to fold the light path. The optical multilayer deposition structure layer is farther away from the image sensor than the reflecting element away from the image sensor along the light path. The nano-rough surface is disposed on one side of the image sensor facing towards the reflecting element, and the nano-rough surface includes a plurality of nano-protruding structures. Shapes of the nano-protruding structures are irregular, and the nano-protruding structures are arranged adjacent to each other.

Abstract: An image capturing module includes an imaging lens system, an image sensor, a first circuit board, at least three passive components, and a second circuit board. The image sensor is at an image side of the imaging lens system and having a photosensitive area corresponding to the imaging lens system. The image sensor and the passive components are disposed on the first circuit board. Each passive component has a first lead and a second lead. The second circuit board corresponds to the first circuit board and includes a connector and multiple circuits electrically connected to the connector. The first leads and the image sensor are electrically connected and disposed on the first circuit board. The second leads form a contact on the first circuit board. The number of the contact is less than the number of the passive components. The contact is electrically connected to at least one circuit.

Abstract: An electronic element assembly includes a first electronic element, an electronic element board and a flexible circuit. The first electronic element is disposed on the electronic element board, and the electronic element board includes a first circuit and a second circuit, wherein the first circuit and the second circuit are disposed on relative sides of the first electronic element, respectively. The flexible circuit is disposed on the electronic element board, and the flexible circuit includes a connecting portion, a bending portion and an electronic path. The connecting portion is connected to the electronic element board. The bending portion is disposed on a side of the connecting portion away from the first electronic element. At least one portion of the electronic path is disposed on the bending portion.

Abstract: An image sensor module includes a sensing surface, a filter element and a first anti-reflective microstructure, wherein the filter element faces towards the sensing surface, and the first anti-reflective microstructure is disposed on the sensing surface. The filter element includes a substrate, an optical deposition layer structure and an optical coating layer, wherein the optical deposition layer structure is disposed on a side of the substrate away from the sensing surface, and the optical coating layer and the optical deposition layer structure are correspondingly disposed on a side of the substrate facing towards the sensing surface. The optical deposition layer structure is multilayer. An air layer is formed between the first anti-reflective microstructure and the filter element, and the first anti-reflective microstructure and the air layer partially overlap at a direction vertical to the sensing surface.

Abstract: A camera module including a lens holder, a lens barrel, a first lens set, a second lens set, and an image sensing device is provided. The lens holder includes a limiting portion. The lens barrel is disposed in the limiting portion. The image sensing device has a common optical axis, and enables the second lens set to be located between the first lens set and the image sensing device. A position of the lens barrel is adjustable in the limiting portion when assembling the camera module, and the lens barrel is disposed on the lens holder enabling the limiting portion to be located on a periphery of the lens barrel, and a gap is arranged between the limiting portion and the lens barrel such that the position of the lens barrel is adjustable along a direction perpendicular to the optical axis.

Abstract: A camera module including a lens holder, a lens barrel, a first lens set, a second lens set, and an image sensing device is provided. The lens holder includes a limiting portion. The lens barrel is disposed in the limiting portion. The image sensing device has a common optical axis, and enables the second lens set to be located between the first lens set and the image sensing device. A position of the lens barrel is adjustable in the limiting portion when assembling the camera module, and the lens barrel is disposed on the lens holder enabling the limiting portion to be located on a periphery of the lens barrel, and a gap is arranged between the limiting portion and the lens barrel such that the position of the lens barrel is adjustable along a direction perpendicular to the optical axis.

Abstract: An assembly method of a camera module is provided. The camera module includes a first and second lens set respectively including at least one lens. The assembly steps include: providing a substrate, a lens holder, and an image sensing device, wherein the image sensing device is located in a space formed by the substrate and the lens holder, and the lens holder includes a limiting portion; disposing the second lens set in the space; assembling a barrel in the limiting portion, wherein the first lens set is disposed in the barrel, the second lens set is located between the first lens set and the image sensing device, and the first and second lens sets and the image sensing device have a common optical axis; inspecting the imaging of the image sensing device; and adjusting a position of the barrel in the limiting portion according to the inspection result.

Abstract: An adjustable filter assembly is provided. The adjustable filter assembly includes a filter and two electrodes. The two electrodes are respectively coupled to a surface of the filter, and electrically coupled to a controller. The controller is configured to apply a voltage to the filter and control the voltage to be changed or not. The voltage causes a state of a molecular arrangement of the filter to change such that a transmittance spectrum of the filter is changed correspondingly. Also, a camera module is provided.

Abstract: An assembly method of a camera module is provided. The camera module includes a first and second lens set respectively including at least one lens. The assembly steps include: providing a substrate, a lens holder, and an image sensing device, wherein the image sensing device is located in a space formed by the substrate and the lens holder, and the lens holder includes a limiting portion; disposing the second lens set in the space; assembling a barrel in the limiting portion, wherein the first lens set is disposed in the barrel, the second lens set is located between the first lens set and the image sensing device, and the first and second lens sets and the image sensing device have a common optical axis; inspecting the imaging of the image sensing device; and adjusting a position of the barrel in the limiting portion according to the inspection result.

Abstract: A camera module includes a sensor unit, a lens unit, and a plurality of conductive members. The sensor unit includes a substrate and an image sensor. The substrate is formed with a plurality of first through holes. The lens unit is disposed on the sensor unit and includes an electrowetting lens device. The electrowetting lens device includes a sealed structure aligned with the image sensor along an optical axis and is formed with a plurality of second through holes. Each of the second through holes is registered with a corresponding one of the first through holes for receiving a corresponding conductive member. A focal length of the electrowetting lens device is adjustably controlled by an electric field applied to the conductive members.

Abstract: A method of manufacturing a miniaturization image capturing module includes adhesively placing a double side adhesive element onto a carrier board; adhesively placing an image capturing chip onto the double side adhesive element; adhesively placing a substrate unit onto the double side adhesive element, the substrate unit including a hollow substrate body adhered to the double side adhesive element and surrounding the image capturing chip; forming a fixing glue between the hollow substrate body and the image capturing chip to fix the position of the image capturing chip relative to the hollow substrate body; electrically connecting the image capturing chip to the substrate unit; positioning a lens unit on the top side of the hollow substrate body, the lens unit including a lens group disposed above the image capturing chip; and then removing the carrier board to expose the double side adhesive element.

Abstract: A miniaturization image capturing module includes a substrate unit, an image capturing unit, a fixing glue unit, and a lens unit. The substrate unit includes a hollow substrate body, a plurality of top conductive pads, a plurality of bottom conductive pads, a plurality of embedded conductive traces. The hollow substrate body has at least one receiving space, and each embedded conductive trace is electrically connected between at least one of the top conductive pads and at least one of the bottom conductive pads. The image capturing unit includes at least one image capturing chip received in the receiving space and electrically connected to the substrate unit. The fixing glue unit includes a fixing glue disposed in the receiving space and fixed between the hollow substrate body and the image capturing chip. The lens unit is disposed on the top side of the hollow substrate body.

Abstract: A method of manufacturing a miniaturization image capturing module includes adhesively placing a double side adhesive element onto a carrier board; adhesively placing an image capturing chip onto the double side adhesive element; adhesively placing a substrate unit onto the double side adhesive element, the substrate unit including a hollow substrate body adhered to the double side adhesive element and surrounding the image capturing chip; forming a fixing glue between the hollow substrate body and the image capturing chip to fix the position of the image capturing chip relative to the hollow substrate body; electrically connecting the image capturing chip to the substrate unit; positioning a lens unit on the top side of the hollow substrate body, the lens unit including a lens group disposed above the image capturing chip; and then removing the carrier board to expose the double side adhesive element.

Abstract: A miniaturization image capturing module includes a substrate unit, an image capturing unit, a fixing glue unit, and a lens unit. The substrate unit includes a hollow substrate body, a plurality of top conductive pads, a plurality of bottom conductive pads, a plurality of embedded conductive traces. The hollow substrate body has at least one receiving space, and each embedded conductive trace is electrically connected between at least one of the top conductive pads and at least one of the bottom conductive pads. The image capturing unit includes at least one image capturing chip received in the receiving space and electrically connected to the substrate unit. The fixing glue unit includes a fixing glue disposed in the receiving space and fixed between the hollow substrate body and the image capturing chip. The lens unit is disposed on the top side of the hollow substrate body.