Abstract: An electronic connector module suitable for being mounted at a motherboard is provided. The electronic connector module includes a connector for selectively coupling an ESD protection component. When the connector receives an static electricity, the connector is grounded through the motherboard via the ESD protection component.

Abstract: A layout of a circuit board includes a first signal layer, a second signal layer, and a third signal layer. The first signal layer has a transmission line. The second signal layer is stacked below the first signal layer, and has an opening. The third signal layer is stacked below the first and second signal layers with the second signal layer sandwiched between the first and third signal layers. The third signal layer is electrically connected to the second signal layer, and both of the second and third signal layers are ground layers or power layers. An orthogonal projection of a segment of the transmission line on the third signal layer is overlapped with that of the opening on the third signal layer. Therefore, an equivalent impedance of the segment of the transmission line with respect to the second and third signal layers can be increased or decreased.

Abstract: A signal generating module for an electronic apparatus is provided. The signal generating module includes a processor, a roller, a resistant film, a conducting member, a first lead and a second lead. The roller has a rotary center and is rotably connected to the electronic apparatus thereby. The conducting member is connected to the rotary center to rotate together with the roller. The conducting member has an end including a conducting contact point. The conducting contact point is configured to rotate around the rotary center along a motion path accompanying the rotation of the roller, wherein the motion path is disposed at a first area of the resistant film. The first lead is coupled to the processor and in contact with the resistant film. The second lead is coupled to the processor, and coupled to the conducting member via the rotary center.

Abstract: A layout of a circuit board includes a first signal layer, a second signal layer, and a third signal layer. The first signal layer has a transmission line. The second signal layer is stacked below the first signal layer, and has an opening. The third signal layer is stacked below the first and second signal layers with the second signal layer sandwiched between the first and third signal layers. The third signal layer is electrically connected to the second signal layer, and both of the second and third signal layers are ground layers or power layers. An orthogonal projection of a segment of the transmission line on the third signal layer is overlapped with that of the opening on the third signal layer. Therefore, an equivalent impedance of the segment of the transmission line referring to the second and third signal layers can be increased or decreased.

Abstract: A signal generating module is provided. The signal generating module includes a processor, an arcuate elastomer, a first fixed contact, a second fixed contact, a first pin, and a second pin. The processor is disposed on the circuit board of an electronic apparatus. The arcuate elastomer is disposed in the electronic apparatus, and includes a first movable contact and a second movable contact. The arcuate elastomer has a portion exposed out from a housing of the electronic apparatus. The first fixed contact is fixed to the electronic apparatus corresponding to the first movable contact. The second fixed contact is fixed to the electronic apparatus corresponding to the second movable contact. The first pin is secured to the circuit board, coupled to the processor, and coupled to the first fixed contact. The second pin is secured to the circuit board, coupled to the processor, and coupled to the second fixed contact.

Abstract: A signal generating module is provided. The signal generating module includes a processor, an arcuate elastomer, a first fixed contact, a second fixed contact, a first pin, and a second pin. The processor is disposed on the circuit board of an electronic apparatus. The arcuate elastomer is disposed in the electronic apparatus, and includes a first movable contact and a second movable contact. The arcuate elastomer has a portion exposed out from a housing of the electronic apparatus. The first fixed contact is fixed to the electronic apparatus corresponding to the first movable contact. The second fixed contact is fixed to the electronic apparatus corresponding to the second movable contact. The first pin is secured to the circuit board, coupled to the processor, and coupled to the first fixed contact. The second pin is secured to the circuit board, coupled to the processor, and coupled to the second fixed contact.