Patents by Inventor Ti OUYANG

Ti OUYANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Server rack heat sink system with combination of liquid cooling device and auxiliary heat sink device
    Patent number: 10356949
    Abstract: A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: July 16, 2019
    Assignee: GUANGDONG SHENLING ENVIRONMENTAL SYSTEMS CO., LTD.
    Inventors: Zhanhua Pan, Minhua Li, Hua Chen, Chunhui Xie, Ti Ouyang, Xuewei Zhang, Yuqun Qiu
  • SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEVICE AND AUXILIARY HEAT SINK DEVICE
    Publication number: 20180042140
    Abstract: A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life.
    Type: Application
    Filed: May 5, 2015
    Publication date: February 8, 2018
    Inventors: Zhanhua PAN, Minhua LI, Hua CHEN, Chunhui XIE, Ti OUYANG, Xuewei ZHANG, Yuqun QIU
  • RELIABLE INTERCONNECT INTEGRATION
    Publication number: 20100109155
    Abstract: A semiconductor device includes a dielectric layer in which an upper portion is densified. An interconnection is disposed in the dielectric layer. The densified portion reduces undercut during subsequent processing, improving reliability of the interconnection.
    Type: Application
    Filed: November 5, 2008
    Publication date: May 6, 2010
    Applicant: Chartered Semiconductor Manufacturing, Ltd.
    Inventors: Huang LIU, Johnny WIDODO, Yihua WANG, Wuping LIU, Ti OUYANG, Wei LU