Patents by Inventor Tiahaar Kurtheru Clayton McKenzie

Tiahaar Kurtheru Clayton McKenzie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level packaging of reduced-height infrared detectors
    Patent number: 10153204
    Abstract: Systems and methods may be provided for generating reduced-height circuit packages such as infrared detector packages. An alignment and dicing system may include an infrared camera that captures images of alignment marks of a wafer assembly through a lid wafer of the wafer assembly, a light source that illuminates the alignment marks through the lid wafer, and dicing equipment that dices the wafer assembly based on infrared images captured using the infrared camera. The light source may illuminate the alignment marks through the lid wafer by providing light such as infrared light to the wafer assembly through optics of the infrared camera. The infrared camera may capture images of alignment marks formed on a detector wafer of the wafer assembly or on an interior or lower surface of the lid wafer through the lid wafer. The dicing equipment may be aligned with the wafer assembly based on the captured images.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: December 11, 2018
    Assignee: FLIR Systems, Inc.
    Inventors: Tiahaar Kurtheru Clayton McKenzie, Richard E. Bornfreund, Devin Leonard, Gregory A. Carlson
  • WAFER LEVEL PACKAGING OF REDUCED-HEIGHT INFRARED DETECTORS
    Publication number: 20150358558
    Abstract: Systems and methods may be provided for generating reduced-height circuit packages such as infrared detector packages. An alignment and dicing system may include an infrared camera that captures images of alignment marks of a wafer assembly through a lid wafer of the wafer assembly, a light source that illuminates the alignment marks through the lid wafer, and dicing equipment that dices the wafer assembly based on infrared images captured using the infrared camera. The light source may illuminate the alignment marks through the lid wafer by providing light such as infrared light to the wafer assembly through optics of the infrared camera. The infrared camera may capture images of alignment marks formed on a detector wafer of the wafer assembly or on an interior or lower surface of the lid wafer through the lid wafer. The dicing equipment may be aligned with the wafer assembly based on the captured images.
    Type: Application
    Filed: June 2, 2015
    Publication date: December 10, 2015
    Inventors: Tiahaar Kurtheru Clayton McKenzie, Richard E. Bornfreund, Devin Leonard, Gregory A. Carlson