Patents by Inventor Tiam Ong

Tiam Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package
    Publication number: 20080105960
    Abstract: An integrated circuit package includes: an integrated circuit having a surface at least partially covered by a metal layer; at least one connection point; at least one connector electrically connecting the integrated circuit with the at least one connection point; and encapsulating material encapsulating the at least one connector, at least some of the integrated circuit and at least some of the at least one connection point, such that a contact surface of the at least one connection point and the metal layer on the integrated circuit are exposed outside the encapsulating material.
    Type: Application
    Filed: January 4, 2008
    Publication date: May 8, 2008
    Inventors: Beng See, Tiam Ong, Chee Lim