Patents by Inventor Tian Hua Dong

Tian Hua Dong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11309262
    Abstract: The present application relates to a technical field of semiconductors, and discloses a device having a physically unclonable function, a method for manufacturing same, and a chip using same.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: April 19, 2022
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Dong Wang, Xiao Yan Bao, Tian Hua Dong, Guang Ning Li
  • Publication number: 20210035925
    Abstract: The present application relates to a technical field of semiconductors, and discloses a device having a physically unclonable function, a method for manufacturing same, and a chip using same.
    Type: Application
    Filed: October 19, 2020
    Publication date: February 4, 2021
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Dong WANG, Xiao Yan BAO, Tian Hua DONG, Guang Ning LI
  • Patent number: 10847477
    Abstract: The present application relates to a technical field of semiconductors, and discloses a device having a physically unclonable function, a method for manufacturing same, and a chip using same.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: November 24, 2020
    Assignees: Semiconductor Manufacturing (Shanghai) International Corporation, Semiconductor Manufacturing (Beijing) International Corporation
    Inventors: Dong Wang, Xiao Yan Bao, Tian Hua Dong, Guang Ning Li
  • Publication number: 20190074256
    Abstract: The present application relates to a technical field of semiconductors, and discloses a device having a physically unclonable function, a method for manufacturing same, and a chip using same.
    Type: Application
    Filed: May 15, 2018
    Publication date: March 7, 2019
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Dong Wang, Xiao Yan Bao, Tian Hua Dong, Guang Ning Li