Patents by Inventor TIAN-LI YE

TIAN-LI YE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210305129
    Abstract: A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.
    Type: Application
    Filed: December 17, 2020
    Publication date: September 30, 2021
    Inventors: Chien-Yu CHEN, Tian-Li YE, Yu CHEN, Chien-An CHEN
  • Publication number: 20210307197
    Abstract: A liquid cooling head device includes a base, a cover covering the base, an inlet portion disposed on the base, an outlet portion formed on the cover, and a fluid pump having a housing and a fan blade. The base includes a diversion channel, an opening and a first chamber connected to the diversion channel and the opening. A second chamber is formed between the cover and the base, and connected to the first chamber through the opening. The inlet portion is connected to the first chamber through the diversion channel. The housing covers one surface of the cover, so that a third chamber is collectively defined by the housing and the cover, and connected with the second chamber and the outlet portion. The fan blade is located in the third chamber, and the diversion channel is located between the fan blade and the first chamber.
    Type: Application
    Filed: March 10, 2021
    Publication date: September 30, 2021
    Inventors: Chien-Yu CHEN, Tian-Li YE, Jen-Hao LIN, Chien-An CHEN
  • Publication number: 20210274680
    Abstract: A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, and a fluid driving module. The power supply module is electrically connected to the control module, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, and fluid driving module are all arranged in the casing. In addition, the control module controls the power supply module to output a corresponding electrical power to the fluid driving module according to an operation status of the fluid driving module.
    Type: Application
    Filed: December 17, 2020
    Publication date: September 2, 2021
    Inventors: Tian-Li YE, Wei-Hao CHEN, Chien-Yu CHEN, Chien-An CHEN
  • Publication number: 20210195793
    Abstract: A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.
    Type: Application
    Filed: December 8, 2020
    Publication date: June 24, 2021
    Inventors: Chien-Yu CHEN, Tian-Li YE, Jen-Hao LIN, Chien-An CHEN
  • Patent number: 10989453
    Abstract: A heat exchanger includes a heat-absorbing part, two vapor conduits, a return conduit and a condensing part. The heat-absorbing part includes a vapor zone and a liquid zone. A first end of each vapor conduit is connected with the vapor zone of the heat-absorbing part. A first end of the return conduit is connected with the liquid zone of the heat-absorbing part. The condensing part includes a vapor-inputting chamber, a liquid-outputting chamber, a partition plate, a communication chamber, a first condenser tube group and a second condenser tube group. The vapor-inputting chamber is connected with a second end of each vapor conduit. The liquid-outputting chamber is connected with a second end of the return conduit. A loop is defined by the heat-absorbing part, the at least two vapor conduits, the return conduit and the condensing part collaboratively.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: April 27, 2021
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Chien-Yu Chen, Tian-Li Ye
  • Publication number: 20200271362
    Abstract: A heat exchanger includes a heat-absorbing part, two gas conduits, a return conduit and a condensing part. The heat-absorbing part includes a gas zone and a liquid zone. The heat-absorbing part includes a gas zone and a liquid zone. A first end of each gas conduit is connected with the gas zone of the heat-absorbing part. A first end of the return conduit is connected with the liquid zone of the heat-absorbing part. The condensing part includes a gas-inputting chamber, a liquid-outputting chamber, a partition plate, a communication chamber, a first condenser tube group and a second condenser tube group. The gas-inputting chamber is connected with a second end of each gas conduit. The liquid-outputting chamber is connected with a second end of the return conduit. A loop is defined by the heat-absorbing part, the at least two gas conduits, the return conduit and the condensing part collaboratively.
    Type: Application
    Filed: April 18, 2019
    Publication date: August 27, 2020
    Inventors: CHIEN-AN CHEN, CHIEN-YU CHEN, TIAN-LI YE
  • Publication number: 20190178583
    Abstract: A thermosyphon-type heat dissipation device includes a heat-absorbing head and a radiator. The heat-absorbing head includes a first outlet, a first inlet, an evaporation chamber and a liquid return chamber. The first outlet is connected with the evaporation chamber. The first inlet is connected with the liquid return chamber. The evaporation chamber and the liquid return chamber are in communication with each other through a gap. An inner space of the evaporation chamber is larger than an inner space of the liquid return chamber. The radiator includes a second inlet and a second outlet. The second inlet is in communication with the first outlet. The second outlet is in communication with the first inlet.
    Type: Application
    Filed: December 12, 2018
    Publication date: June 13, 2019
    Inventors: CHIEN-AN CHEN, MU-SHU FAN, CHIEN-YU CHEN, TIAN-LI YE