Patents by Inventor Tian-Lin Yan

Tian-Lin Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10242308
    Abstract: The present invention provides a radio frequency identification and sensing device comprising an antenna module, a RFID sensing module, and battery module. The antenna module has a first flexible substrate having an antenna circuit formed thereon. The RFID sensing module comprises a second flexible substrate, a RFID chip, a sensor formed on the second flexible substrate and a memory module formed on the second flexible substrate, wherein the sensor is utilized to detecting an environmental status for generating a plurality of sensing data, and the memory module is utilized to store the plurality of sensing data. The RFID chip is utilized to transfer the plurality of data to a reading device. The battery module is utilized to provide electrical power for operating the RFID sensing module.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: March 26, 2019
    Assignee: Securitag Assembly Group Co., Ltd
    Inventors: Tian lin Yan, Cheng hung Chang, Way Yu Chen
  • Patent number: 10166707
    Abstract: The present invention provides an RFID device and manufacturing method. The RFID device comprises a first housing, an antenna module, and a second housing. The antenna module arranged on the first housing comprises a base substrate, and an antenna layer, sticking on an outer surface of the base substrate. The second housing is formed to couple to the first housing by an injection molding process so that the antenna module is arranged between the first and second housings.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: January 1, 2019
    Assignee: SECURITAG ASSEMBLY GROUP CO., LTD
    Inventors: Cheng hung Chang, Ching Mei Chi, Chun Jun Chuang, Ya Chi Shen, Tian lin Yan
  • Publication number: 20180169917
    Abstract: The present invention provides an RFID device and manufacturing method. The RFID device comprises a first housing, an antenna module, and a second housing. The antenna module arranged on the first housing comprises a base substrate, and an antenna layer, sticking on an outer surface of the base substrate. The second housing is formed to couple to the first housing by an injection molding process so that the antenna module is arranged between the first and second housings.
    Type: Application
    Filed: December 19, 2017
    Publication date: June 21, 2018
    Applicant: Securitag Assembly Group Co., Ltd
    Inventors: Cheng hung Chang, Ching Mei Chi, Chun Jun Chuang, Ya Chi Shen, Tian lin Yan
  • Publication number: 20180174017
    Abstract: The present invention provides a radio frequency identification and sensing device comprising an antenna module, a RFID sensing module, and battery module. The antenna module has a first flexible substrate having an antenna circuit formed thereon. The RFID sensing module comprises a second flexible substrate, a RFID chip, a sensor formed on the second flexible substrate and a memory module formed on the second flexible substrate, wherein the sensor is utilized to detecting an environmental status for generating a plurality of sensing data, and the memory module is utilized to store the plurality of sensing data. The RFID chip is utilized to transfer the plurality of data to a reading device. The battery module is utilized to provide electrical power for operating the RFID sensing module.
    Type: Application
    Filed: February 24, 2017
    Publication date: June 21, 2018
    Applicant: Securitag Assembly Group Co., Ltd
    Inventors: Tian lin Yan, Cheng hung Chang, Way Yu Chen
  • Patent number: 9619743
    Abstract: The present invention provides a radio frequency identification device comprising an antenna module and a substrate module. The antenna module has a flexible substrate having an antenna circuit forming thereon. A first surface of the flexible substrate further has a first and a second electrical connecting pads coupled to the antenna circuit, wherein the antenna circuit does not pass through a space between the first and second electrical connecting pads. The substrate module comprises a RFID chip and at least one passive element electrically coupled to a substrate having a pair of third electrical connecting pads. A conductive adhesive formed between the first and second electrical connecting pads and the third electrical connecting pads is utilized to couple the antenna module with the substrate module.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: April 11, 2017
    Assignee: SECURITAG ASSEMBLY GROUP CO., LTD.
    Inventors: Tian-Lin Yan, Cheng-Hung Chang, Way-Yu Chen, Wen-Fan Chang