Patents by Inventor Tian Ooi

Tian Ooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet
    Patent number: 9817079
    Abstract: A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: November 14, 2017
    Assignee: Infineon Technologies AG
    Inventors: Choo Tian Ooi, Chew Theng Tai, Klaus Elian, Mohd Hirzarul Hafiz Mohd Tahir
  • MOLDED SENSOR PACKAGE WITH AN INTEGRATED MAGNET AND METHOD OF MANUFACTURING MOLDED SENSOR PACKAGES WITH AN INTEGRATED MAGNET
    Publication number: 20160018476
    Abstract: A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.
    Type: Application
    Filed: July 21, 2014
    Publication date: January 21, 2016
    Inventors: Choo Tian Ooi, Chew Theng Tai, Klaus Elian, Mohd Hirzarul Hafiz Mohd Tahir
  • Process for producing oligomers
    Publication number: 20060003903
    Abstract: The present invention relates to a process for producing oligomers and a method for improving the low temperature properties of fatty alkyl esters by using these oligomers. The oligomers according to the present invention are used as pour point depressant and cloud point reducer to improve the pour point and cloud point of fatty alkyl esters such as isopropyl, butyl, ethyl, ethylhexyl esters particularly fatty acid methyl esters at low temperature.
    Type: Application
    Filed: July 1, 2005
    Publication date: January 5, 2006
    Inventors: Tian Ooi, Salmiah Ahmad, Shoot Yeong, Chun Teoh