Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.

Abstract: A charging case for a pair of wireless earphones comprising: a housing having a peripheral wall that defines a shell; a frame insert coupled to the housing and extending into the shell, the frame insert having one or more insert walls that define first and second pockets sized and shaped to accept first and second wireless earphones, respectively, wherein the one or more insert walls cooperate with the housing primary wall to define a sealed chamber within the charging case; a lid coupled to the housing and operable between a closed position in which the lid covers the first and second pockets and an open position in which the first and second pockets are exposed; a speaker module disposed within the sealed chamber, the speaker module comprising an audio driver having a diaphragm that separates a front volume of the audio driver from a back volume of the audio driver and a speaker vent disposed within the back volume; one or more first openings formed through the peripheral wall and opening into the front vol

Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

Abstract: A charging case for a pair of wireless earphones comprising: a housing having a peripheral wall that defines a shell; a frame insert coupled to the housing and extending into the shell, the frame insert having one or more insert walls that define first and second pockets sized and shaped to accept first and second wireless earphones, respectively, wherein the one or more insert walls cooperate with the housing primary wall to define a sealed chamber within the charging case; a lid coupled to the housing and operable between a closed position in which the lid covers the first and second pockets and an open position in which the first and second pockets are exposed; a speaker module disposed within the sealed chamber, the speaker module comprising an audio driver having a diaphragm that separates a front volume of the audio driver from a back volume of the audio driver and a speaker vent disposed within the back volume; one or more first openings formed through the peripheral wall and opening into the front vol

Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.

Abstract: This application relates to the field of communications technologies, and provides a system and method for providing wireless network access, and an electronic device. The system includes a first electronic device and a second electronic device. The first electronic device receives a first operation of a user, where the first operation is used to share or project first data in the first electronic device to the second electronic device. The first electronic device establish a Wi-Fi direct connection to the second electronic device in response to the first operation; and receive a second operation of the user, where the second operation is used to enable a network sharing function of the first electronic device. The second electronic device receives the first data from the first electronic device; and performs data receiving and sending with a network side by using the network sharing function of the first electronic device.

Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.

Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.

Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Abstract: A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

Abstract: A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.