Patents by Inventor Tian Shi LI
Tian Shi LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230421196Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.Type: ApplicationFiled: September 12, 2023Publication date: December 28, 2023Inventors: Daniel R. Bloom, Chelsea E. Wojeski, Edward Siahaan, Nathan Morris, Ryan S. Haley, Tian Shi Li, Toni Ristoski
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Patent number: 11784673Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.Type: GrantFiled: September 8, 2021Date of Patent: October 10, 2023Assignee: APPLE INC.Inventors: Daniel R. Bloom, Chelsea E. Wojeski, Edward Siahaan, Nathan Morris, Ryan S. Haley, Tian Shi Li, Toni Ristoski
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Publication number: 20230269513Abstract: A charging case for a pair of wireless earphones comprising: a housing having a peripheral wall that defines a shell; a frame insert coupled to the housing and extending into the shell, the frame insert having one or more insert walls that define first and second pockets sized and shaped to accept first and second wireless earphones, respectively, wherein the one or more insert walls cooperate with the housing primary wall to define a sealed chamber within the charging case; a lid coupled to the housing and operable between a closed position in which the lid covers the first and second pockets and an open position in which the first and second pockets are exposed; a speaker module disposed within the sealed chamber, the speaker module comprising an audio driver having a diaphragm that separates a front volume of the audio driver from a back volume of the audio driver and a speaker vent disposed within the back volume; one or more first openings formed through the peripheral wall and opening into the front volType: ApplicationFiled: August 24, 2022Publication date: August 24, 2023Applicant: APPLE INC.Inventors: Benjamin A. Cousins, Jarrett Lagler, Dirk Schmelzer, Sebastien D. de Rivaz, Tian Shi Li, Phillip Qian, Rebecca Russell, Jeyakkrishnan Chengleput Srinivasan, Jue Wang, Jerzy S. Guterman, Joel C. Yamasaki
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Publication number: 20230262375Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.Type: ApplicationFiled: April 24, 2023Publication date: August 17, 2023Applicant: Apple Inc.Inventors: Jason Joseph LeBlanc, Rohan Gupta, Robert D. Zupke, Todd K. Moyer, Cuneyt Bakan, Brooke L. Bunney, Justin T. Ng, Jeff A. Kalt, Tian Shi Li, Lionel B. Barrow
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Patent number: 11665462Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.Type: GrantFiled: September 16, 2021Date of Patent: May 30, 2023Assignee: Apple Inc.Inventors: Jason Joseph LeBlanc, Rohan Gupta, Robert D. Zupke, Todd K. Moyer, Cuneyt Bakan, Brooke L. Bunney, Justin T. Ng, Jeff A. Kalt, Tian Shi Li, Lionel B. Barrow
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Patent number: 11450999Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.Type: GrantFiled: September 16, 2020Date of Patent: September 20, 2022Assignee: Apple Inc.Inventors: Eric T. SooHoo, Mahmoud R. Amini, Daniel R. Bloom, Sean T. McIntosh, Tian Shi Li, Jared M. Kole, Jason Joseph LeBlanc, Colin M. Ely, Peter J. Cameron, Michael A. Kinney, Eric S. Jol, Edward Siahaan, Robert D. Zupke, Rohan Gupta, Jordan J. Francis
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Publication number: 20220085560Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.Type: ApplicationFiled: September 16, 2020Publication date: March 17, 2022Applicant: Apple Inc.Inventors: Eric T. SooHoo, Mahmoud R. Amini, Daniel R. Bloom, Sean T. McIntosh, Tian Shi Li, Jared M. Kole, Jason Joseph LeBlanc, Colin M. Ely, Peter J. Cameron, Michael A. Kinney, Eric S. Jol, Edward Siahaan, Robert D. Zupke, Rohan Gupta, Jordan J. Francis
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Publication number: 20220085843Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.Type: ApplicationFiled: September 8, 2021Publication date: March 17, 2022Inventors: Daniel R. Bloom, Chelsea E. Wojeski, Edward Siahaan, Nathan Morris, Ryan S. Haley, Tian Shi Li, Toni Ristoski
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Patent number: 11252492Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: GrantFiled: May 19, 2020Date of Patent: February 15, 2022Assignee: Apple Inc.Inventors: Jared M. Kole, Daniel R. Bloom, Audrey L. Sheng, Tian Shi Li, Eugene Antony Whang
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Patent number: 11184696Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.Type: GrantFiled: September 16, 2020Date of Patent: November 23, 2021Assignee: Apple Inc.Inventors: Tian Shi Li, Daniel R. Bloom, Jerzy S. Guterman, Jue Wang, Toni Ristoski, Jared M. Kole, Edward Siahaan, Eugene Antony Whang
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Patent number: 11134327Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: GrantFiled: May 19, 2020Date of Patent: September 28, 2021Assignee: Apple Inc.Inventors: Jason J. LeBlanc, Daniel R. Bloom, Edward Siahaan, Phillip Qian, Lee M. Panecki, Eugene Antony Whang, Jared M. Kole, Audrey L. Sheng, Tian Shi Li
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Patent number: 11134328Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: GrantFiled: May 19, 2020Date of Patent: September 28, 2021Assignee: Apple Inc.Inventors: Jared M. Kole, Daniel R. Bloom, Audrey L. Sheng, Tian Shi Li, Eugene Antony Whang, Edward Siahaan, Phillip Qian, Alex C. Hellwig, Oliver M. Hewitt, Yuta Kuboyama, Christopher S. Erickson, Sneha Kadetotad, Edwin J. Corona Aparicio, Rajesh Anantharaman, Jacob E. Mattingley, Tsu-Hui Lin, Robert D. Zupke, Dustin A. Hatfield, Axit H. Patel
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Publication number: 20200280785Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: May 19, 2020Publication date: September 3, 2020Inventors: Jared M. Kole, Daniel R. Bloom, Audrey L. Sheng, Tian Shi Li, Eugene Antony Whang
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Publication number: 20200280786Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: May 19, 2020Publication date: September 3, 2020Applicant: Apple Inc.Inventors: Jared M. Kole, Daniel R. Bloom, Audrey L. Sheng, Tian Shi Li, Eugene Antony Whang, Edward Siahaan, Phillip Qian, Alex C. Hellwig, Oliver M. Hewitt, Yuta Kuboyama, Christopher S. Erickson, Sneha Kadetotad, Edwin J. Corona Aparicio, Rajesh Anantharaman, Jacob E. Mattingley, Tsu-Hui Lin, Robert D. Zupke, Dustin A. Hatfield, Axit H. Patel
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Publication number: 20200280784Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: May 19, 2020Publication date: September 3, 2020Inventors: Jason J. LeBlanc, Daniel R. Bloom, Edward Siahaan, Phillip Qian, Lee M. Panecki, Eugene Antony Whang, Jared M. Kole, Audrey L. Sheng, Tian Shi Li
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Patent number: 10310157Abstract: An accessory device is disclosed. The accessory device may include a light guide assembly that directs light from a light source (or sources) through an opening of the accessory device, and in particular, in a base portion of the accessory device. The light guide assembly may be disposed in a compartment of the accessory device and include a light guide body as well as a light guide insert disposed in an opening of the light guide body. To form the opening, a single cutting operation may cut through the base portion and the light guide body so that the respective openings of the base portion and the light guide body are aligned. The light guide body may be designed to receive the light from the light source and direct or focus the light toward the light guide insert. The light guide insert may refract, scatter, and/or diffuse the light.Type: GrantFiled: September 16, 2016Date of Patent: June 4, 2019Assignee: APPLE INC.Inventors: Timothy J. Rasmussen, Ian P. Colahan, Darshan R. Kasar, Tian Shi Li
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Publication number: 20170160455Abstract: An accessory device is disclosed. The accessory device may include a light guide assembly that directs light from a light source (or sources) through an opening of the accessory device, and in particular, in a base portion of the accessory device. The light guide assembly may be disposed in a compartment of the accessory device and include a light guide body as well as a light guide insert disposed in an opening of the light guide body. To form the opening, a single cutting operation may cut through the base portion and the light guide body so that the respective openings of the base portion and the light guide body are aligned. The light guide body may be designed to receive the light from the light source and direct or focus the light toward the light guide insert. The light guide insert may refract, scatter, and/or diffuse the light.Type: ApplicationFiled: September 16, 2016Publication date: June 8, 2017Inventors: Timothy J. RASMUSSEN, Ian P. COLAHAN, Darshan R. KASAR, Tian Shi LI