Patents by Inventor Tian-Wen LIAO

Tian-Wen LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for removing photoresist layer from alignment mark
    Patent number: 11747742
    Abstract: An apparatus for removing a photoresist layer from at least one alignment mark of a wafer is provided. The apparatus includes a holder, a solvent dispenser, and a suction unit. The holder is used to support the wafer, wherein the alignment mark is formed in a peripheral region of the wafer. The solvent dispenser is used to spray a solvent onto the photoresist layer on the alignment mark of the wafer to generate a dissolved photoresist layer. The suction unit is used to remove the dissolved photoresist layer and the solvent from the wafer through exhausting.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: September 5, 2023
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Yuan-Chun Chao, Tian-Wen Liao, Wei-Chuan Chen, Yi-Chang Chang, Yu-Ming Tseng
  • APPARATUS AND METHOD FOR REMOVING PHOTORESIST LAYER FROM ALIGNMENT MARK
    Publication number: 20180292758
    Abstract: An apparatus for removing a photoresist layer from at least one alignment mark of a wafer is provided. The apparatus includes a holder, a solvent dispenser, and a suction unit. The holder is used to support the wafer, wherein the alignment mark is formed in a peripheral region of the wafer. The solvent dispenser is used to spray a solvent onto the photoresist layer on the alignment mark of the wafer to generate a dissolved photoresist layer. The suction unit is used to remove the dissolved photoresist layer and the solvent from the wafer through exhausting.
    Type: Application
    Filed: April 11, 2017
    Publication date: October 11, 2018
    Inventors: Yuan-Chun CHAO, Tian-Wen LIAO, Wei-Chuan CHEN, Yi-Chang CHANG, Yu-Ming TSENG