Abstract: A lead frame (200) for housing an integrated circuit is disclosed comprising a main member (220) and an engagement portion (230) for receiving an integrated circuit (210). The integrated circuit (210) is located at the engagement portion (230) and engaged with the lead frame through resilient engagement with the first and second engagement members (222, 223). The first and second engagement members (222,223) which depend from the main member, secure the integrated to the lead frame by engaging in resilient contact respective opposed surfaces of the integrated circuit. The integrated circuit is engaged to the lead frame by clipping into it into position between the engagement members. There is no need for a gluing process unlike conventional lead frame designs which where the integrated circuit is attached to a lead frame by gluing it onto the die paddle.

Abstract: A lead frame (1) has a first portion (2) adapted to have a semiconductor device (10) mounted thereon and a second portion (3) including a main member (5), a number of first contact members (6) and a number of second contact members (7). The first and second contact members (6, 7) depend from the main member (5). The second portion (3) at least partially surrounds the first portion (6). The first contact members (6) extend form the main member (5) in a direction away for the first portion (2) and the second contact members (7) extend from the main member (5) in a direction towards the first portion (2).