Patents by Inventor Tiancheng LUO

Tiancheng LUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955948
    Abstract: This application provides a bulk acoustic wave resonator and a bulk acoustic wave filter, and relates to the technical field of filters. The bulk acoustic wave resonator includes a substrate, and a bottom electrode, a piezoelectric layer, a top electrode which are sequentially stacked on the substrate, and an outline of an orthographic projection of the top electrode on the substrate is formed by four curves which are end-to-end connected. Arc transition is set at a joint of every two adjacent curves, and every two curves arranged in a spaced manner are not parallel. Accordingly, reliability of devices can be effectively improved, meanwhile, parasitic resonance amplitude can be effectively restrained, a Q value is increased, and thus device properties are improved.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: April 9, 2024
    Assignee: Wuhan MEMSonics Technologies Co., Ltd.
    Inventors: Kunli Zhao, Yan Liu, Tiancheng Luo, Bowoon Soon, Chengliang Sun
  • Publication number: 20230231528
    Abstract: A resonator and a preparation method of a resonator, and a filter relate to the technical field of resonators.
    Type: Application
    Filed: January 17, 2023
    Publication date: July 20, 2023
    Inventors: Tiancheng LUO, Yao CAI, Chao GAO, Yang ZOU, Binghui LIN, Kaixiang LONG, Bowoon SOON, Chengliang SUN
  • Publication number: 20230223908
    Abstract: The present disclosure provides a single crystal film bulk acoustic resonator, a manufacturing method for a single crystal film bulk acoustic resonator, and a filter, and relates to the technical field of filters. The method includes: sequentially forming a buffer layer, a piezoelectric layer, and a first electrode that are stacked on a temporary base substrate; forming a first bonding layer on the first electrode; providing a substrate; etching the substrate to form a plurality of first bumps on a surface of the substrate; forming a second bonding layer covering top surfaces of the plurality of first bumps on the surface of the substrate; and bonding the second bonding layer located at the top surfaces of the plurality of first bumps to the first bonding layer.
    Type: Application
    Filed: November 16, 2022
    Publication date: July 13, 2023
    Inventors: Yang ZOU, Yao CAI, Binghui LIN, Tiancheng LUO, Chao GAO, Dawdon CHEAM, Bowoon SOON, Chengliang SUN