Abstract: A riding mowing device includes a seat used for a user to sit on and including a seat cushion and a backrest; a frame for supporting the seat; a cutting assembly including a cutting deck and a mowing element for mowing grass, where the mowing element is at least partially accommodated in the cutting deck, and the cutting assembly is mounted to the frame; a traveling assembly for driving the riding mowing device to travel; a control circuit board for controlling at least the cutting assembly and the traveling assembly; and a power supply assembly for supplying power to at least the cutting assembly and the traveling assembly. At least part of the control circuit board is disposed between the seat and the power supply assembly.

Abstract: System and method for sensing movement such as chest movement of each of a plurality of target test subjects by: transmitting, at each of N transmitting antennas (TXs) of a phased multiple-input multiple-output (phased-MIMO) radar, a common frequency modulated continuous wave (FMCW) signal in each of a plurality of time division multiplex (TDM) slots, each TDM slot having associated with it a respective weight selected in accordance with a transmit steering vector configured to cause a coherent summation of transmitted signal in a desired direction ?0 toward at least one target; receiving target-reflected energy associated with the transmitted FMCW signals at a virtual array formed by stacking signal from P TDM slots received via M receiving antennas (RXs) of the phased-MIMO radar; and processing an output of the virtual array to extract therefrom signal received from the desired direction ?0 to determine thereby target movement in the desired direction ?0.

Abstract: A wafer-level chip structure, a multiple-chip stacked and interconnected structure and a fabricating method thereof, wherein the wafer-level chip structure includes: a through-silicon via, which penetrates a wafer; a first surface including an active region, a multi-layered redistribution layer and a bump; and a second surface including an insulation dielectric layer, and a frustum transition structure connected with the through-silicon via. In an embodiment of the present application, a frustum type impedance transition structure is introduced into a position between a TSV exposed area on a backside of a wafer and a UBM so as to implement an impedance matching between TSV and UBM, thereby alleviating the problem of signal distortion that is caused by an abrupt change of impedance.