Abstract: An organic light emitting diode display panel includes a thin film transistor array layer disposed on a flexible substrate, and including thin film transistors, a reflective anode, and a pixel defining layer. The pixel defining layer has a patterned structure defining non-light emitting regions and light emitting regions, each being between the non-light emitting regions; a black matrix layer disposed on the non-light emitting regions; a light emitting module disposed on a surface of the black matrix layer and the pixel defining layer, and including a plurality of pixel units. Each pixel unit includes a red subpixel, a green subpixel, and a blue subpixel respectively correspondingly disposed in one light emitting region and disposed on the reflective anode; a filter film layer including a red filter, a green filter, and a blue filter respectively correspondingly disposed on one red subpixel, one green subpixel and one blue subpixel.

Abstract: An organic light-emitting diode (OLED) display device is provided in the present invention, including a flexible substrate, a thin film transistor (TFT) layer, an OLED light emitting layer, a light extraction film layer, an inorganic protection film layer, and a packaging film layer. The light extraction film layer includes a first light extraction film layer and a second light extraction film layer. A nano-imprint process is performed on the second light extraction film layer to form a micro-lens array. The present invention also provides a manufacturing method of the OLED display device.

Abstract: A method of manufacturing a thin film encapsulation layer includes providing a substrate provided with an organic light emitting diode (OLED) light emitting device; forming a barrier layer on the substrate, wherein the barrier layer surrounds the OLED light emitting device and includes an organic material having hydrophobic properties; forming a first inorganic encapsulation layer on the substrate, wherein the first encapsulation layer covers the OLED light emitting device; and removing the barrier layer.

Abstract: A flexible OLED device and a manufacturing method thereof. The flexible OLED device includes a flexible substrate, an insulating layer, a thin film transistor layer, a planarization layer, a pixel-defining layer, an organic light emitting layer and a thin film encapsulation layer. At least one of the planarization layer, a protrusion of the pixel-defining layer or the thin film encapsulation layer is provided with a notch passing through at least one film layer in which the planarization layer, the protrusion of pixel-defining layer or the thin film encapsulation layer is located, wherein the notch is formed by photolithography. The notch is filled with a first material. By utilizing flexibility of the first material, flexibility of a flexible OLED device is improved, and the flexible OLED device that can be bent inward and outward is realized.

Abstract: The present disclosure provides a display panel and a method for manufacturing the same. The method includes forming a base layer, a thin film transistor (TFT) device layer, an organic light-emitting diode (OLED) device layer, and a first inorganic material in turn on a substrate; modifying a surface of the first inorganic material to increase flowability of an organic buffer layer that is to be formed on a surface of the first inorganic layer; and forming the organic buffer layer and a second inorganic layer in turn on the first inorganic layer. According to the present disclosure, flowability of the organic material formed on the inorganic material layer is increased.

Abstract: The invention provides a flexible display panel and a fabricating method thereof. The flexible display panel includes a flexible substrate, one or more layers of a laser absorbing layer disposed in the flexible substrate, and a display functional layer disposed on the flexible substrate, the laser absorbing layer containing a fluorine-containing aromatic organic compound as an ultraviolet light absorber. The fluorine-containing aromatic organic compound used the ultraviolet light absorbing agent has strong ultraviolet light absorbing ability, and is chemically stable, and can be stably present in a flexible substrate, thereby being capable of absorbing excess laser energy in the LLO process and preventing the excess laser energy in the LLO process from further carbonizing the display functional layer on the flexible substrate. Thus, the LLO process yield of the flexible display panel is effectively improved and the yield of the product is greatly improved as a result.

Abstract: The beneficial effects of the present application are as follows: the modified epoxy resin is doped with the modified epoxy resin in the buffer layer, the modified epoxy resin is reacted with the first barrier layer under UV irradiation, so that the modified epoxy resin is adhered to the first barrier layer to adhere the buffer layer and the first barrier layer and solve the technical problem that the organic layer and the inorganic layer are easily peeled off in the prior art. The present application also provides a packaging method and an electronic device.

Abstract: An organic light emitting diode display panel includes a thin film transistor array layer disposed on a flexible substrate, and including thin film transistors, a reflective anode, and a pixel defining layer. The pixel defining layer has a patterned structure defining non-light emitting regions and light emitting regions, each being between the non-light emitting regions; a black matrix layer disposed on the non-light emitting regions; a light emitting module disposed on a surface of the black matrix layer and the pixel defining layer, and including a plurality of pixel units. Each pixel unit includes a red subpixel, a green subpixel, and a blue subpixel respectively correspondingly disposed in one light emitting region and disposed on the reflective anode; a filter film layer including a red filter, a green filter, and a blue filter respectively correspondingly disposed on one red subpixel, one green subpixel and one blue subpixel.

Abstract: An organic light emitting diode (OLED) display panel includes a thin film transistor (TFT) array substrate; an OLED light-emitting layer; an encapsulation layer; an inducing layer disposed on a light-emitting side of the OLED light-emitting layer; a micro lens array film disposed over the inducing layer; and an organic hydrophobic layer disposed between the inducing layer and the micro lens array film. By providing the organic hydrophobic layer with strong hydrophobic performance, a surface with a large water contact angle is provided for a subsequent formation of the micro lens array film, thereby improving an optical coupling ratio of the micro lens, and improving luminous efficiency of the OLED light emitting layer.

Abstract: The beneficial effects of the present application are as follows: the modified epoxy resin is doped with the modified epoxy resin in the buffer layer, the modified epoxy resin is reacted with the first barrier layer under UV irradiation, so that the modified epoxy resin is adhered to the first barrier layer to adhere the buffer layer and the first barrier layer and solve the technical problem that the organic layer and the inorganic layer are easily peeled off in the prior art. The present application also provides a packaging method and an electronic device.

Abstract: A method of manufacturing a thin film encapsulation layer includes providing a substrate provided with an organic light emitting diode (OLED) light emitting device; forming a barrier layer on the substrate, wherein the barrier layer surrounds the OLED light emitting device and includes an organic material having hydrophobic properties; forming a first inorganic encapsulation layer on the substrate, wherein the first encapsulation layer covers the OLED light emitting device; and removing the barrier layer.

Abstract: The present disclosure provides a display panel and a method for manufacturing the same. The method includes forming a base layer, a thin film transistor (TFT) device layer, an organic light-emitting diode (OLED) device layer, and a first inorganic material in turn on a substrate; modifying a surface of the first inorganic material to increase flowability of an organic buffer layer that is to be formed on a surface of the first inorganic layer; and forming the organic buffer layer and a second inorganic layer in turn on the first inorganic layer. According to the present disclosure, flowability of the organic material formed on the inorganic material layer is increased.

Abstract: Provided is a thin-film encapsulation structure for OLED, which includes a substrate loaded with an OLED, a first inorganic blocking layer, an organic buffer layer, and a second inorganic blocking layer. The refractive index of the first inorganic blocking layer is set to decrease along the direction from OLED to organic blocking layer, and the refractive index of organic blocking layer is smaller than that of first inorganic blocking layer, and the refractive index of second inorganic blocking layer is smaller than that of organic blocking layer. The refractive index change among the first inorganic blocking layer, the organic buffer layer, and the second inorganic blocking layer enhances the luminous efficiency and isolate the moisture and oxygen from entering OLED, prevents the interior of OLED from being corroded and improves thermal insulation effect. The organic buffer layer can wrap extrinsic substance in large particle and alleviate stress during planarization process.

Abstract: The beneficial effects of the present application are as follows: the modified epoxy resin is doped with the modified epoxy resin in the buffer layer, the modified epoxy resin is reacted with the first barrier layer under UV irradiation, so that the modified epoxy resin is adhered to the first barrier layer to adhere the buffer layer and the first barrier layer and solve the technical problem that the organic layer and the inorganic layer are easily peeled off in the prior art. The present application also provides a packaging method and an electronic device.

Abstract: The disclosure discloses a fabricating method of an OLED device, including the following steps: coating a polyimide material on a glass substrate to form a base substrate, the base substrate including a material capable of absorbing water and oxygen; fabricating an OLED device layer on the TFT layer; the disclosure also discloses a corresponding OLED device. In the embodiment of the disclosure, the water and oxygen blocking performance of the PI layer in the OLED device can be enhanced, and the service life of the OLED device can be improved.