Abstract: Methods for forming non-volatile storage elements in a non-volatile storage system are described. In some embodiments, during a forming operation, a cross-point memory array may be biased such that waste currents are minimized or eliminated. In one example, the memory array may be biased such that a first word line comb is set to a first voltage, a second word line comb interdigitated with the first word line comb is set to the first voltage, and selected vertical bit lines are set to a second voltage such that a forming voltage is applied across non-volatile storage elements to be formed. In some embodiments, a memory array may include a plurality of word line comb layers and a forming operation may be concurrently performed on non-volatile storage elements on all of the plurality of word line comb layers or a subset of the plurality of word line comb layers.

Abstract: A three-dimensional array especially adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.

Abstract: Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion.

Abstract: A data storage device includes a memory die and a controller coupled to the memory die. The memory die includes a resistive memory and read/write circuitry configured to determine a first hard bit value and a second hard bit value of a storage element of the resistive memory. The first hard bit value and the second hard bit value are determined using opposite polarity read voltages. The controller is configured to perform error correction with respect to data read from the resistive memory.

Abstract: Methods for forming non-volatile storage elements in a non-volatile storage system are described. In some embodiments, a plurality of forming operations may be performed in which non-volatile storage elements located near the far end of a plurality of word line fingers associated with a word line comb are formed prior to forming other non-volatile storage elements. In one example, non-volatile storage elements may be formed in each of the plurality of word line fingers in parallel and in an order that forms non-volatile storage elements in each of the plurality of word line fingers that are located near the far ends of the plurality of word line fingers before forming other non-volatile storage elements. Each non-volatile storage element that is formed during a forming operation may be current limited while a forming voltage is applied across the non-volatile storage element.

Abstract: Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion.

Abstract: Methods for operating a non-volatile memory that includes a plurality of memory arrays in which each memory array of the plurality of memory arrays may independently perform a SET operation, a RESET operation, or a read operation are described. The ability to independently SET or RESET memory arrays allows a SET operation to be performed on a first set of memory cells within a first memory array at the same time as a RESET operation is performed on a second set of memory cells within a second memory array. In some cases, the first memory array may be associated with a first memory bay and the second memory array may be associated with a second memory bay. Each memory bay may include a memory array, read/write circuits, and control circuitry for determining memory cell groupings and programming memory cells within the memory array based on the memory cell groupings.

Abstract: Independent sense amplifier addressing provides separate column addresses to individual sense amplifier groups within a single bay during one column address cycle. A memory system determines whether the individual memory cells or bits of a column at a bay can be skipped. For each sense amplifier group having at least one memory cell (or bit) that needs to be programmed, the system determines for the first column address whether the memory cell can be skipped. If a bit or memory cell having a first column address from the sense amplifier group can be skipped, the system determines a next bit having a column address from the group that needs to be programmed. The system groups the next column address for programming during the first column address cycle. The system can program a different column address for different sense amplifier groups within the bay during a single column address cycle.

Abstract: A method is provided for reading a memory cell of a nonvolatile memory system. The method includes generating a hard bit and N soft bits for the memory cell in a total time corresponding to a single read latency period and N+1 data transfer times.

Abstract: Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion.

Abstract: Methods for operating a non-volatile memory that includes a plurality of memory arrays in which each memory array of the plurality of memory arrays may independently perform a SET operation, a RESET operation, or a read operation are described. The ability to independently SET or RESET memory arrays allows a SET operation to be performed on a first set of memory cells within a first memory array at the same time as a RESET operation is performed on a second set of memory cells within a second memory array. In some cases, the first memory array may be associated with a first memory bay and the second memory array may be associated with a second memory bay. Each memory bay may include a memory array, read/write circuits, and control circuitry for determining memory cell groupings and programming memory cells within the memory array based on the memory cell groupings.

Abstract: A method of fabricating a resistance-based memory includes initiating formation of a conductive path through a storage element of the resistance-based memory. The method further includes recording data of one or more parameters associated with the formation of the conductive path.

Abstract: A method includes, in a data storage device including a resistive memory, receiving an erase command to erase a portion of the resistive memory. The method further includes sending shaped data to be stored at the portion of the resistive memory responsive to the erase command.

Abstract: A data storage device includes a memory die. The memory die includes a resistive random access memory (ReRAM) having a first portion and a second portion that is adjacent to the first portion. A method includes determining whether to access the second portion of the ReRAM in response to initiating a first operation targeting the first portion of the ReRAM. The method further includes initiating a second operation that senses information stored at the second portion to generate sensed information in response to determining to access the second portion. The method further includes initiating a third operation to rewrite the information at the ReRAM in response to detecting an indication of a disturb condition based on the sensed information.

Abstract: A data storage device includes a memory die. The memory die includes a resistive memory. A method includes determining a power characteristic associated with performing a write process to write data to the resistive memory. The method further includes initiating a modified write process in response to detecting that the power characteristic satisfies a threshold.

Abstract: A data storage device includes a memory die and a controller coupled to the memory die. The memory die includes a resistive memory and read/write circuitry configured to determine a first hard bit value and a second hard bit value of a storage element of the resistive memory. The first hard bit value and the second hard bit value are determined using opposite polarity read voltages. The controller is configured to perform error correction with respect to data read from the resistive memory.

Abstract: A method is provided for reading a memory cell of a nonvolatile memory system. The method includes generating a hard bit and N soft bits for the memory cell in a total time corresponding to a single read latency period and N+1 data transfer times.

Abstract: A programming technique for a set of resistance-switching memory cells such as ReRAM cell involves programming the low resistance cells to the high resistance state (in a reset process) early in a programming operation, before programming the high resistance cells to the low resistance state (in a set process), to minimize losses due to leakage currents. The reset process can be performed in one or more phases. In some cases, a current limit is imposed which limits the number of cells which can be reset at the same time. Initially, the cells which are to be reset and set are identified by comparing a logical value of their current resistance state to a logical value of write data. If there is a match, the cell is not programmed. If there is not a match, the cell is programmed.

Abstract: Methods for operating a non-volatile storage system are described. The non-volatile storage system includes a plurality of bit lines, a plurality of word line combs each comprising a plurality of word lines, and a plurality of resistance-switching memory elements. Each resistance-switching memory element is coupled between one of the bit lines and one of the word lines. The method includes calibrating a plurality of bias voltages for the word lines and bit lines based on estimates of data values stored in the resistance-switching memory elements.

Abstract: A data storage device includes a resistive random access memory (ReRAM). The data storage device includes read circuitry coupled to a storage element of the ReRAM. The read circuitry is configured to read a data value from the storage element, during a read operation, based on a read current sensed during a first phase of the reading operation and a leakage current sensed during a second phase of the reading operation. The data storage device also includes a controller coupled to the read circuitry. The controller is configured to provide an input value to an error correction coding (ECC) decoder, where the input value includes a hard bit value and a soft bit value. The hard bit value corresponds to the data value, and the soft bit value is at least partially based on the leakage current.