Patents by Inventor Tianmin Zheng

Tianmin Zheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11799043
    Abstract: Disclosed are a method and an apparatus for string connecting photovoltaic modules. The method includes: acquiring position information of n photovoltaic modules to be connected; categorizing the n photovoltaic modules into m partitions based on the position information of the n photovoltaic modules; generating k candidate connection solutions of an ith partition in the m partitions, wherein the ith partition includes m photovoltaic modules, and each of the k candidate connection solutions uses one photovoltaic module in the m photovoltaic modules as a starting point, and obtaining at least one string of photovoltaic modules by simulating connection of the m photovoltaic modules according to a preset connection solution; and selecting a target connection solution from the k candidate connection solutions based on an estimated cable use amount corresponding to each of the k candidate connection solutions.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: October 24, 2023
    Assignees: ENVISION DIGITAL INTERNATIONAL PTE. LTD., SHANGHAI ENVISION DIGITAL CO., LTD.
    Inventors: Yijie Hu, Ning Xu, Chen Zhang, Xiu Jiang, Guokun Huang, Tianmin Zheng
  • Publication number: 20230027541
    Abstract: Disclosed are a method and an apparatus for string connecting photovoltaic modules. The method includes: acquiring position information of n photovoltaic modules to be connected; categorizing the n photovoltaic modules into m partitions based on the position information of the n photovoltaic modules; generating k candidate connection solutions of an ith partition in the m partitions, wherein the ith partition includes m photovoltaic modules, and each of the k candidate connection solutions uses one photovoltaic module in the m photovoltaic modules as a starting point, and obtaining at least one string of photovoltaic modules by simulating connection of the m photovoltaic modules according to a preset connection solution; and selecting a target connection solution from the k candidate connection solutions based on an estimated cable use amount corresponding to each of the k candidate connection solutions.
    Type: Application
    Filed: November 25, 2020
    Publication date: January 26, 2023
    Applicants: ENVISION DIGITAL INTERNATIONAL PTE.LTD., SHANGHAI ENVISION DIGITAL CO., LTD.
    Inventors: Yijie HU, Ning XU, Chen ZHANG, Xiu JIANG, Guokun HUANG, Tianmin ZHENG
  • Patent number: 6251333
    Abstract: A method of manufacturing a film-covered article by the following steps. A thermoplastic film is heated to become pliable. The film has a decorative surface and a backing surface. The heated film is positioned between an open mold. The open mold has a first mold surface, a sealing surface and a sealing member. The sealing surface contacts the sealing member and forms a chamber between the mold and the film. A fluid pressure is applied between the mold and the film to cause the film to conform to the first mold surface. A molten resin is injected adjacent to the film-backing surface to form the film-covered article. The invention may be practiced by either applying a positive pressure to push the film to conform to the first mold surface or a negative pressure to drawing the film against a vacuum between the film and the first mold surface.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: June 26, 2001
    Assignee: Ford Motor Company
    Inventors: Tianmin Zheng, David Charles Knisely
  • Patent number: 5909012
    Abstract: A gas assisted injection molded part includes internal cavities extending between two surfaces of the part. The cavities are plated for electrical conductivity after a surface cleaning and etching process. The part may be an automobile instrument panel wherein the internal cavities are plated to create a series of "bus" conductor lines. These lines carry power, ground and/or electrical signals over relatively large distances, allowing other components to attach at points along the structure eliminating the need for discrete wiring and wire harness interconnect assemblies.
    Type: Grant
    Filed: October 21, 1996
    Date of Patent: June 1, 1999
    Assignee: Ford Motor Company
    Inventors: Michael George Todd, Charles Frederick Schweitzer, Robert Edward Belke, Jr., Tianmin Zheng