Patents by Inventor Tianqiang Huang

Tianqiang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12154890
    Abstract: A packaged IC includes a fanout layer, an Application Processor (AP) die having a first surface residing substantially adjacent a first surface of the fanout layer, a Redistribution Layer (RDL) having a first surface coupled to a second surface of the AP die Process, and high bandwidth memory coupled to a second surface of the RDL and configured to communicate wirelessly with the AP die. The packaged IC further includes an encapsulant surrounding a substantial portion of the high bandwidth memory, the RDL, and the AP die, the encapsulant contacting the fanout layer on a first side and having an exposed second side, a plurality of conductive posts extending from the fanout layer to the RDL through a portion of the encapsulant, and a plurality of Through Mold Vias (TMVs) extending between the fanout layer and the exposed second side of the encapsulant.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: November 26, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shiqun Gu, Rui Niu, Tianqiang Huang
  • Publication number: 20240331739
    Abstract: This disclosure discloses a memory, a memory use method, a memory manufacturing method, and an electronic device. The memory includes a control layer and at least one storage layer stacked on the control layer. The storage layer includes a plurality of storage channels, and each storage channel includes an independent data interface bus. The control layer includes a plurality of controllers and a plurality of user interfaces, the controller is configured to access data stored in a storage channel connected to the controller. The plurality of controllers are connected to the data interface buses of the plurality of storage channels in one-to-one correspondence. A quantity of user interfaces is the same as a quantity of user storage channels that can be invoked by a user. The quantity of user interfaces is less than a quantity of controllers.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Inventors: Jincan Guo, Tianqiang Huang, Rongbin Liu, Jieqiang Chen, Yun Liu, Zhengbo Wang
  • Publication number: 20210358894
    Abstract: A packaged IC includes a fanout layer, an Application Processor (AP) die having a first surface residing substantially adjacent a first surface of the fanout layer, a Redistribution Layer (RDL) having a first surface coupled to a second surface of the AP die Process, and high bandwidth memory coupled to a second surface of the RDL and configured to communicate wirelessly with the AP die. The packaged IC further includes an encapsulant surrounding a substantial portion of the high bandwidth memory, the RDL, and the AP die, the encapsulant contacting the fanout layer on a first side and having an exposed second side, a plurality of conductive posts extending from the fanout layer to the RDL through a portion of the encapsulant, and a plurality of Through Mold Vias (TMVs) extending between the fanout layer and the exposed second side of the encapsulant.
    Type: Application
    Filed: July 29, 2021
    Publication date: November 18, 2021
    Inventors: Shiqun Gu, Rui Niu, Tianqiang Huang