Abstract: The present disclosure provides a display device comprising: a display panel having a light-exiting upper surface, a lower surface opposite to the light-exiting upper surface and a plurality of side edge end surfaces between the light-exiting upper surface and the lower surface, and having a first group of bonding electrodes at a side where a first side edge end surface in the plurality of side edge end surfaces is located; a first flexible circuit board electrically connected to the first group of bonding electrodes; a first insulating protection layer at a side of the first flexible circuit board away from the first group of bonding electrodes, wherein its upper edge is higher than an upper edge of the first flexible circuit board, and its lower edge is lower than the first group of bonding electrodes; a first conductive layer; and a first adhesive layer. The present disclosure also provides a display apparatus comprising the display device and a composite adhesive tape for a display device.

Abstract: A manufacturing method for ceramics with complex structure by laser 3D printing, includes acquiring a three-dimensional model of a complex component to be fabricated, and devising a laser scanning path; placing a substrate in a gas-phase reactor chamber, followed by vacuuming and aerating vapor mixture of gas-phase precursors and carrier gas into the gas-phase reactor chamber; preheating the substrate to a specified temperature, turning on a laser and a thermal imager, the thermal imager controlling laser power in real time by generating a two-dimensional temperature map of a laser spot to realize temperature control a the printing process; setting a distance between the flat-field focusing lens and the substrate and a laser scanning speed; after stacking another one of the ceramic sheets repeatedly, until completing a fabrication of a ceramic complex component.

Abstract: A wet etching method is provided in the present disclosure. The method includes providing a substrate, where a layer to-be-etched is on a surface of the substrate; and performing etching treatments on the layer to-be-etched till a thickness of the layer to-be-etched reaches a target thickness. Each etching treatment includes performing a first etching process, where the substrate is at a first rotation speed; after the first etching process, performing a second etching process, where a rotation speed of the substrate is reduced from the first rotation speed to a second rotation speed, and a liquid film of a chemical solution on the surface of the substrate is increased to a first thickness; and after the second etching process, performing a third etching process, where the substrate is at a third rotation speed, and the third rotation speed is lower than or equal to the first rotation speed.

Abstract: A wet etching method is provided in the present disclosure. The method includes providing a substrate, where a layer to-be-etched is on a surface of the substrate; and performing etching treatments on the layer to-be-etched till a thickness of the layer to-be-etched reaches a target thickness. Each etching treatment includes performing a first etching process, where the substrate is at a first rotation speed; after the first etching process, performing a second etching process, where a rotation speed of the substrate is reduced from the first rotation speed to a second rotation speed, and a liquid film of a chemical solution on the surface of the substrate is increased to a first thickness; and after the second etching process, performing a third etching process, where the substrate is at a third rotation speed, and the third rotation speed is lower than or equal to the first rotation speed.