Patents by Inventor Tianyu Zhu

Tianyu Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8203420
    Abstract: Subminiature surface mount chip fuses include two part housings enclosing a fuse element and prefabricated end caps. The housing ends are shaped to restrict freedom of movement of the fuse element ends as the end caps are assembled to the housing. The end caps may include features to positively secure them in place and restrict relative movement of the end caps relative to the housing. Holes may be provided in the end caps that allow solder flow from a location exterior to the end caps to flow interior to the end caps to establish electrical connection with the fuse element.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: June 19, 2012
    Assignee: Cooper Technologies Company
    Inventors: Sidharta Wiryana, Essie Rahdar, Tianyu Zhu
  • Publication number: 20100328020
    Abstract: Subminiature surface mount chip fuses include two part housings enclosing a fuse element and prefabricated end caps. The housing ends are shaped to restrict freedom of movement of the fuse element ends as the end caps are assembled to the housing. The end caps may include features to positively secure them in place and restrict relative movement of the end caps relative to the housing. Holes may be provided in the end caps that allow solder flow from a location exterior to the end caps to flow interior to the end caps to establish electrical connection with the fuse element.
    Type: Application
    Filed: June 26, 2009
    Publication date: December 30, 2010
    Inventors: Sidharta Wiryana, Essie Rahdar, Tianyu Zhu
  • Publication number: 20090167480
    Abstract: The invention relates to a method of manufacturing a circuit protector and to a circuit protector. The method comprises the steps of providing a substrate having opposing end portions, coupling an element layer to the top surface of the substrate, and laser machining the element layer to shape the element layer into a predetermined geometry. The circuit protector comprises a substrate having opposing end portions, termination pads coupled to the top surface at opposing end portions of the substrate, a fuse element disposed across a space between the termination pads and electrically connecting the termination pads, the fuse element having a predetermined geometry; the predetermined geometry having the narrowest width of about 0.025 to about 0.050 millimeters, a cover coupling the top surface and suffusing the substrate, the fuse element and the termination pads, and end terminations in electrical contact with the termination pads at the opposing end portions.
    Type: Application
    Filed: December 29, 2007
    Publication date: July 2, 2009
    Inventors: Sidharta Wiryana, Tianyu Zhu