Abstract: In one embodiment, a power electronics assembly includes a power device assembly further including an S-cell. The S-cell includes a first metal layer having a recess, a graphite layer bonded to the first metal layer, a second metal layer bonded to the graphite layer, and a ceramic layer, wherein the ceramic layer has a first metalized surface and a second metalized surface, and the first metalized surface is bonded to the second metal layer by a solder layer. The power electronics assembly further includes a power device disposed within the recess of the first metal layer, and a cold plate, wherein the second metalized surface of the ceramic layer is bonded to a surface of the cold plate.

Abstract: Power electronics device assemblies, circuit board assemblies, and power electronics assemblies are disclosed. In one embodiment, a power electronics device assembly includes an S-cell including a first metal layer comprising a first surface having a recess, a first graphite layer bonded to the first metal layer, a second metal layer bonded to the first graphite layer, a solder layer disposed on the second metal layer, and an electrically insulating layer bonded to the solder layer. The power electronics device assembly may further include a power electronics device disposed within the recess of the first surface of the first metal layer.

Abstract: A power electronics assembly includes a circuit board assembly including a first electrically insulating layer, an electrically insulating substrate, a laminate panel provided between the first electrically insulating layer and the electrically insulating substrate, and one or more electrically conductive layers provided within the electrically insulating substrate. The laminate panel includes a power electronics device assembly including an S-cell and a power electronics device. The S-cell includes a graphite layer and a metal layer encasing the graphite layer. A recess is formed in an outer surface of the metal layer and the power electronics device is disposed within the recess of the outer surface of the S-cell.

Abstract: A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)-cold plate assemblies includes bonding a power device fabrication panel to a multi-layer PCB, drilling via passageways in the multi-layer PCB, and electroplating a conductive metal into the vias before bonding the power device fabrication panel to a plurality of cold plates and forming an IPEs embedded PCB-cold plate fabrication panel. The method also includes cutting the IPEs embedded PCB-cold plate fabrication panel into a plurality of highly IPEs embedded PCB-cold plate assemblies.

Abstract: A method of fabricating or manufacturing a highly integrated power electronics (IPEs) embedded printed circuit board (PCB)—cold plate assembly includes bonding a cold plate substrate onto a first side of a power device—substrate assembly, bonding a multi-layer PCB onto a second side of the power device—substrate assembly, and bonding a cold plate manifold onto the multi-layer PCB and forming a cold plate in thermal communication a power device of the power device—substrate assembly. The multi-layer PCB can be 3D printed onto the second side of the power device—substrate assembly and bonding of the cold plate manifold to the multi-layer PCB can be reinforced with mechanical fasteners.

Abstract: A method for manufacturing a power device fabrication panel includes aligning a first alignment mark in a lead frame of a power device substrate array with a second alignment mark in a bonding fixture. The power device substrate array includes a plurality of power device pockets, the bonding fixture includes a plurality of power device openings, and the power device openings are in assembly alignment with the power device pockets when the first alignment mark is aligned with the second alignment mark. And with the bonding fixture power device openings in assembly alignment with the power device pockets of the power device substrate array, a plurality of power devices are moved at least partially through the aligned power device openings and into the power device pockets where they are bonded.

Abstract: A power card for use in a vehicle includes a plurality of chip-on-chip structures and a manifold. The chip-on-chip structures include an N lead frame, a P lead frame, an O lead frame, and a first and a second power device. The N lead frame, P lead frame, and O lead frame each have a body portion and a terminal portion extending outward from the body portion. The O lead frame is located between the N lead frame and the P lead frame. The first power device is located on a first side of the O lead frame and the second power device is located on a second side of the O lead frame. The manifold surrounds the body portions the N lead frame, the P lead frame, and the O lead frame and fluidly coupled to an inlet and an outlet, configured to receive a cooling liquid.

Abstract: A power electronics assembly, power electronics device assemblies, and a cold plate incorporating power electronics device assemblies are disclosed. The power electronics assembly includes a cold plate including a power electronics device assembly including an S-cell and a power electronics device. The S-cell includes a first graphite layer a second graphite layer and a metal layer encasing the first graphite layer and the second graphite layer. A recess is formed in an outer surface of the metal layer. The power electronics device is disposed within the recess of the outer surface of the S-cell.

Abstract: A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)—cold plate assemblies or units includes assembling an integrated power electronics embedded PCB fabrication panel onto a cold plate fabrication panel and forming an integrated power electronics embedded PCB—cold plate fabrication panel. The integrated power electronics embedded PCB—cold plate fabrication panel is cut into a plurality of highly integrated power electronics embedded PCB—cold plate assemblies such that the plurality of highly integrated power electronics embedded PCB—cold plate assemblies individually include an integrated power electronics embedded PCB attached to and in thermal communication with a cold plate. Also, the cold plate can include a fluid chamber configured for a cooling fluid to flow therethrough.

Abstract: A power device embedded printed circuit board (PCB) assembly includes a cold plate, a multi-layer PCB with at least one power device embedded therein bonded to and in thermal communication with the cold plate, and a chemical vapor deposition (CVD) dielectric layer disposed between the cold plate and the multi-layer PCB. The CVD dielectric layer can be applied to the cold plate and a bonding layer can be sandwiched between the CVD dielectric layer and the multi-layer PCB with at least one power device assembly embedded therein. In the alternative, CVD dielectric layer can be applied top the multi-layer PCB with at least one power device assembly embedded therein and bonding layer can be sandwiched between the CVD dielectric layer and the cold plate.

Abstract: A highly integrated power electronics embedded PCB-cold plate assembly includes a cold plate, a power electronics embedded printed circuit board (PCB), and a low thermal resistance dielectric layer sandwiched between the cold plate and the power electronics embedded PCB. The power electronics embedded PCB is bonded to the cold plate via the low thermal resistance dielectric layer to form highly integrated power electronics embedded PCB—cold plate assembly is formed. And in one example, the low thermal resistance dielectric layer sandwiched between and directly bonded to the cold plate and the power electronics embedded PCB.

Abstract: A power card for use in a vehicle includes a N lead frame, a P lead frame, and an O lead frame. The O lead frame includes, in part, an embedded copper-graphite thermal conductor. Part of the O lead frame is located between the N lead frame and the P lead frame. A first power device is located on a first side of the O lead frame between the N lead frame and the O lead frame. A second power device being located on a second side of the O lead frame between the O lead frame and the P lead frame. The O lead frame is configured to receive heat from the first power device and the second power device and transfer the heat for heat dissipation.

Abstract: A 3D printing system includes a reservoir for a UV-curable dielectric material in communication with a first nozzle configured to print the UV-curable dielectric material onto a substrate and a reservoir for a low CTE filler in communication with a second nozzle configured to print the low CTE filler onto the substrate, and a reservoir for a conductive ink in communication with a third nozzle configured to print the conductive ink onto the substrate. The 3D printing system prints the UV-curable dielectric material and the low CTE filler such that the printed low CTE filler mixes with the printed UV-curable dielectric material and forms a UV-curable dielectric layer with the low CTE filler dispersed therein.

Abstract: In one embodiment, a power electronics assembly includes a power device assembly further including an S-cell. The S-cell includes a first metal layer having a recess, a graphite layer bonded to the first metal layer, a second metal layer bonded to the graphite layer, and a ceramic layer, wherein the ceramic layer has a first metalized surface and a second metalized surface, and the first metalized surface is bonded to the second metal layer by a solder layer. The power electronics assembly further includes a power device disposed within the recess of the first metal layer, and a cold plate, wherein the second metalized surface of the ceramic layer is bonded to a surface of the cold plate.

Abstract: Power electronics device assemblies, circuit board assemblies, and power electronics assemblies are disclosed. In one embodiment, a power electronics device assembly includes an S-cell including a first metal layer comprising a first surface having a recess, a first graphite layer bonded to the first metal layer, a second metal layer bonded to the first graphite layer, a solder layer disposed on the second metal layer, and an electrically insulating layer bonded to the solder layer. The power electronics device assembly may further include a power electronics device disposed within the recess of the first surface of the first metal layer.

Abstract: A power electronics assembly, power electronics device assemblies, and a cold plate incorporating power electronics device assemblies are disclosed. The power electronics assembly includes a cold plate including a power electronics device assembly including an S-cell and a power electronics device. The S-cell includes a first graphite layer a second graphite layer and a metal layer encasing the first graphite layer and the second graphite layer. A recess is formed in an outer surface of the metal layer. The power electronics device is disposed within the recess of the outer surface of the S-cell.

Abstract: A power electronics assembly includes a circuit board assembly including a first electrically insulating layer, an electrically insulating substrate, a laminate panel provided between the first electrically insulating layer and the electrically insulating substrate, and one or more electrically conductive layers provided within the electrically insulating substrate. The laminate panel includes a power electronics device assembly including an S-cell and a power electronics device. The S-cell includes a graphite layer and a metal layer encasing the graphite layer. A recess is formed in an outer surface of the metal layer and the power electronics device is disposed within the recess of the outer surface of the S-cell.

Abstract: Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.

Abstract: Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.

Abstract: Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.