Abstract: A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.

Abstract: The present invention discloses methods for manufacturing chip resistor networks, which are free from the short circuit owing to electron migration of the silver electrodes. In one embodiment of the present invention, a barrier layer is formed to prevent the silver electrodes from electron migration. In another embodiment of the present invention, copper or nickel electrodes are formed to replace silver electrodes. These methods for manufacturing chip resistor networks are the ways to solve the short circuit caused by electron migration of the silver electrodes.

Abstract: A method for preventing the overflowing of the molding compound is disclosed. The method provides a substrate that having at least a pair of outer leads. By the pressed downward the pair of outer leads as the thimble point, the substrate can contact with the mold completely without any gap therebetween, thus, the overflowing of the molding compound would not be occurred.

Abstract: A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.

Abstract: The present invention provides a package structure, which includes a substrate, wherein the circuit has been configured within the substrate; a lead-frame having lead on the first surface of the substrate; at least one first electronic device located on the lead-frame; a second electronic device located on the first surface of the substrate whose the circuit has been configured therein; a plurality of conductive wires, which used for electrically coupling the first electronic device and second electronic device, and the second electronic device with the lead-frame; a molding compound, which used to seal the portion of substrate, the first electronic device, the second electronic device, and the portion of the lead-frame; and a metal plate, which located on the second surface of the substrate, and used to remove the heat that is generated from the first electronic device.

Abstract: This invention discloses an inductor that includes a conducting wire composed of an alloy having temperature coefficients of resistance (TCR) approximately 0.0002 milliohm per Celsius degree or is lower. The inductive coil has a winding configuration provided for enclosure in a substantially rectangular box with a mid-plane extended along an elongated direction of the rectangular box wherein the conducting wire interesting at least twice near said mid-plane.

Abstract: This invention discloses an inductor includes a conducting wire having a winding configuration provided for enclosure in a substantially rectangular box with a mid-plane extended along an elongated direction of the rectangular box wherein the conducting wire interesting at least twice near said mid-plane.

Abstract: This invention discloses a method for manufacturing an inductor by first press punching a first and a second layer of conductive plates into a first and second coil layers with a first and second inductor lead layers as single integrated layers. The manufacturing process further includes a step of overlapping and connecting the first and second coil layers to form an inductor. In a preferred embodiment, process of manufacturing further includes a step of mixing epoxy to bond with a highly magnetic material and pressure molding the bonding magnetic material around the coil layers to form an inductor.

Abstract: This invention discloses a method for manufacturing an inductor by first press punching a first and a second layer of conductive plates into a first and second coil layers with a first and second inductor lead layers as single integrated layers. The manufacturing process further includes a step of overlapping and connecting the first and second coil layers to form an inductor. In a preferred embodiment, process of manufacturing further includes a step of mixing epoxy to bond with a highly magnetic material and pressure molding the bonding magnetic material around the coil layers to form an inductor.