Patents by Inventor Tiao Zhou
Tiao Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240105861Abstract: An optical system includes a circuit board, an optical emitter device mounted on the circuit board, and a cap mounted on the circuit board. The cap and the circuit board together define a chamber therebetween, the chamber enclosing the optical emitter device. The cap includes one or more opaque regions and one or more transparent regions, wherein the one or more opaque regions of the cap are configured to prevent light emitted from the optical emitter device from travelling out of the chamber in one or more undesirable directions, wherein the one or more transparent regions of the cap are configured to allow light emitted from the optical emitter device to travel out of the chamber in one or more desirable directions.Type: ApplicationFiled: December 3, 2021Publication date: March 28, 2024Applicant: ams International AGInventor: Tiao ZHOU
-
Patent number: 10608125Abstract: Packaging techniques are described for fabricating an sensor package that include one or more sensor devices, such as optical sensors or light sources, where an active side of the sensor device is exposed. Additionally, the side of the sensor package including the sensor die is substantially flat (e.g., topology is less than about 75 ?m), the sensor package does not include wire bonding, and the package interconnect (e.g., solder bump array or other connection) is disposed on a side of the sensor package opposite the sensor die.Type: GrantFiled: September 27, 2013Date of Patent: March 31, 2020Assignee: MAXIM INTEGRATED PRODUCTS, INC.Inventor: Tiao Zhou
-
Patent number: 10204876Abstract: A device and fabrication techniques are described that employ wafer-level packaging techniques for fabricating semiconductor devices that include a pad defined contact. In implementations, the wafer-level package device that employs the techniques of the present disclosure includes a substrate, a passivation layer, a top metal contact pad, a thin film with a via formed therein, a redistribution layer structure configured to contact the top metal contact pad, and a dielectric layer on the thin film and the redistribution layer structure. In implementations, a process for fabricating the wafer-level package device that employs the techniques of the present disclosure includes processing a substrate, forming a passivation layer, depositing a top metal contact pad, forming a thin film with a via formed therein, forming a redistribution layer structure in the via formed in the thin film, and forming a dielectric layer on the thin film and the redistribution layer structure.Type: GrantFiled: March 7, 2013Date of Patent: February 12, 2019Assignee: MAXIM INTEGRATED PRODUCTS, INC.Inventors: Tiao Zhou, Ricky Agrawal, Abhishek Choudhury
-
Patent number: 9583425Abstract: A wafer level package includes a wafer, a lead disposed of the wafer for connecting the wafer to an electrical circuit, and a core disposed of the lead. In some embodiments, the lead disposed of the wafer is a copper pillar, and the core is plated onto the copper pillar. In some embodiments, the core is polymer screen-plated onto the lead. In some embodiments, the core extends between at least approximately thirty-five micrometers (35 ?m) and fifty micrometers (50 ?m) from the lead. In some embodiments, the core covers between at least approximately one-third (?) and one-half (½) of the surface area of the lead. In some embodiments, the core comprises a stud-shape extending from the lead. In some embodiments, the core extends perpendicularly across the lead. In some embodiments, the core extends longitudinally along the lead. Further, a portion of the core can extend perpendicularly from a longitudinal core.Type: GrantFiled: June 28, 2013Date of Patent: February 28, 2017Assignee: Maxim Integrated Products, Inc.Inventors: Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar M. Rahim, Viren Khandekar, Yi-Sheng Anthony Sun, Arkadii V. Samoilov
-
Patent number: 9425064Abstract: Techniques are described herein for a dip soldering process which provides a low-profile, low-cost solder bump formation process which may be implemented to promote package thickness scaling (e.g., reduce the overall package thickness). For example, the dip soldering process disclosed herein may enable ultra-thin wafer-level packages (WLP), ultra-thin wafer level quad-flat no-leads (WQFN) packages, or the like.Type: GrantFiled: December 18, 2012Date of Patent: August 23, 2016Inventors: Karthik Thambidurai, Viren Khandekar, Tiao Zhou
-
Patent number: 9371982Abstract: In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board. In implementations, fabricating the sensor package device includes receiving a photodefinable glass-based substrate, etching the photodefinable glass-based substrate, and forming a ceramic portion of the photodefinable glass-based substrate.Type: GrantFiled: December 20, 2013Date of Patent: June 21, 2016Assignee: Maxim Integrated Products, Inc.Inventor: Tiao Zhou
-
Patent number: 9356003Abstract: Packaging techniques are described for fabricating a flex sensor package that includes a flex printed circuit with a flex window, an adhesive layer with an adhesive layer window, and a stiffener assembly with a stiffener window on a first side of the flex printed circuit and a semiconductor die on a second side of the flex printed circuit. In implementations, fabricating the flex sensor package includes receiving a flex printed circuit including at least one flex window, placing an adhesive layer on at least a portion of a first side of the flex printed circuit, placing a stiffener assembly on the adhesive layer, and placing at least one semiconductor die on a second side of the flex printed circuit, where an active portion of the at least one semiconductor die is aligned with the at least one flex window and the adhesive layer window.Type: GrantFiled: April 1, 2014Date of Patent: May 31, 2016Assignee: Maxim Integrated Products, Inc.Inventor: Tiao Zhou
-
Patent number: 9040408Abstract: Semiconductor package devices, such as wafer-level package semiconductor devices, are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar.Type: GrantFiled: December 19, 2013Date of Patent: May 26, 2015Assignee: Maxim Integrated Products, Inc.Inventors: Tiao Zhou, Joseph W. Serpiello, Md. Kaysar Rahim, Yong L. Xu, Karthik Thambidurai, Viren Khandekar
-
Publication number: 20150049498Abstract: In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board. In implementations, fabricating the sensor package device includes receiving a photodefinable glass-based substrate, etching the photodefinable glass-based substrate, and forming a ceramic portion of the photodefinable glass-based substrate.Type: ApplicationFiled: December 20, 2013Publication date: February 19, 2015Applicant: Maxim Integrated Products, Inc.Inventor: Tiao Zhou
-
Publication number: 20140131859Abstract: A wafer level package includes a wafer, a lead disposed of the wafer for connecting the wafer to an electrical circuit, and a core disposed of the lead. In some embodiments, the lead disposed of the wafer is a copper pillar, and the core is plated onto the copper pillar. In some embodiments, the core is polymer screen-plated onto the lead. In some embodiments, the core extends between at least approximately thirty-five micrometers (35 ?m) and fifty micrometers (50 ?m) from the lead. In some embodiments, the core covers between at least approximately one-third (?) and one-half (½) of the surface area of the lead. In some embodiments, the core comprises a stud-shape extending from the lead. In some embodiments, the core extends perpendicularly across the lead. In some embodiments, the core extends longitudinally along the lead. Further, a portion of the core can extend perpendicularly from a longitudinal core.Type: ApplicationFiled: June 28, 2013Publication date: May 15, 2014Inventors: Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar M. Rahim, Viren Khandekar, Yi-Sheng Anthony Sun, Arkadii V. Samoilov
-
Patent number: 8259464Abstract: WLP semiconductor devices include bump assemblies that have a barrier layer for inhibiting electromigration within the bump assemblies. In an implementation, the bump assemblies include copper posts formed on the integrated circuit chips of the WLP devices. Barrier layers formed of a metal such as nickel (Ni) are provided on the outer surface of the copper posts to inhibit electromigration in the bump assembly. Oxidation prevention caps formed of a metal such as tin (Sn) are provided over the barrier layer. Solder bumps are formed over the oxidation prevention caps. The oxidation prevention caps inhibit oxidation of the barrier layer during fabrication of the bump assemblies.Type: GrantFiled: June 24, 2010Date of Patent: September 4, 2012Assignee: Maxim Integrated Products, Inc.Inventors: Tiao Zhou, Arkadii V. Samoilov
-
Patent number: 8163220Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.Type: GrantFiled: May 27, 2008Date of Patent: April 24, 2012Assignee: STMicroelectronics, Inc.Inventors: Michael J. Hundt, Tiao Zhou
-
Publication number: 20110317385Abstract: WLP semiconductor devices include bump assemblies that have a barrier layer for inhibiting electromigration within the bump assemblies. In an implementation, the bump assemblies include copper posts formed on the integrated circuit chips of the WLP devices. Barrier layers formed of a metal such as nickel (Ni) are provided on the outer surface of the copper posts to inhibit electromigration in the bump assembly. Oxidation prevention caps formed of a metal such as tin (Sn) are provided over the barrier layer. Solder bumps are formed over the oxidation prevention caps. The oxidation prevention caps inhibit oxidation of the barrier layer during fabrication of the bump assemblies.Type: ApplicationFiled: June 24, 2010Publication date: December 29, 2011Applicant: MAXIM INTEGRATED PRODUCTS, INC.Inventors: Tiao Zhou, Arkadii V. Samoilov
-
Patent number: 8084871Abstract: An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.Type: GrantFiled: November 10, 2009Date of Patent: December 27, 2011Assignee: Maxim Integrated Products, Inc.Inventors: S. Kaysar Rahim, Tiao Zhou, Arkadii Samoilov, Viren Khandekar, Yong Li Xu
-
Patent number: 7989961Abstract: An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.Type: GrantFiled: November 10, 2009Date of Patent: August 2, 2011Assignee: Maxim Integrated Products, Inc.Inventors: S. Kaysar Rahim, Tiao Zhou, Arkadii Samoilov, Viren Khandekar, Yong Li Xu
-
Publication number: 20110108981Abstract: An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.Type: ApplicationFiled: November 10, 2009Publication date: May 12, 2011Applicant: MAXIM INTEGRATED PRODUCTS, INC.Inventors: KAYSAR RAHIM, TIAO ZHOU, ARKADII SAMOILOV, VIREN KHANDEKAR, YONG LI XU
-
Publication number: 20080290557Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.Type: ApplicationFiled: May 27, 2008Publication date: November 27, 2008Applicant: STMICROELECTRONICS, INC.Inventors: Michael J. Hundt, Tiao Zhou
-
Patent number: 7402454Abstract: An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.Type: GrantFiled: December 14, 2006Date of Patent: July 22, 2008Assignee: STMicroelectronics, Inc.Inventors: Tiao Zhou, Michael J. Hundt
-
Patent number: 7315079Abstract: A thermally-enhanced ball grid array package structure is provided that includes an integrated circuit chip, a heat spreader and a substrate. The integrated circuit chip has a specified surface area. The heat spreader is coupled to the integrated circuit chip. The substrate is coupled to the heat spreader. The substrate has a specified surface area. The heat spreader covers a specified portion of the surface area of the substrate that is greater than the surface area of the integrated circuit chip. The heat spreader is operable to dissipate heat from the integrated circuit chip over the specified portion of the surface area of the substrate.Type: GrantFiled: February 20, 2007Date of Patent: January 1, 2008Assignee: STMicroelectronics, Inc.Inventors: Tiao Zhou, Michael J. Hundt
-
Patent number: 7304362Abstract: An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.Type: GrantFiled: May 20, 2002Date of Patent: December 4, 2007Assignee: STMicroelectronics, Inc.Inventors: Tiao Zhou, Michael J. Hundt