Patents by Inventor Tiawan Semiconductor Manufacturing Company., Ltd.

Tiawan Semiconductor Manufacturing Company., Ltd. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interposer-on-Glass Package Structure
    Publication number: 20130174417
    Abstract: A method comprises providing an interposer comprising a substrate and a first through-substrate via (TSV) penetrating through the substrate, forming a first oxide layer on a surface of the interposer, bonding a glass substrate to the interposer through a fusion bonding, with the first oxide layer being between the interposer and the glass substrate and forming a second TSV in the glass substrate and electrically coupled to the first TSV.
    Type: Application
    Filed: March 4, 2013
    Publication date: July 11, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Tiawan Semiconductor Manufacturing Company., Ltd.