Patents by Inventor Tibo HOU

Tibo HOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11785124
    Abstract: A housing assembly, a method for manufacturing the housing assembly, and an electronic device are provided according to the present disclosure. The housing assembly includes a housing body and a flexible film layer. The housing body has a bottom portion and at least one side wall connected with an outer edge of the bottom portion, and each of the at least one side wall and the bottom portion cooperatively define a bending angle larger than 70 degrees. The flexible film layer is disposed on a first surface of the housing body, and the flexible film layer has an elongation at break higher than or equal to 150%.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: October 10, 2023
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Sipeng Bi, Guangming Yang, Tibo Hou
  • Publication number: 20220078935
    Abstract: A housing assembly and a fabrication method thereof, and an electronic device. The housing assembly includes: a housing base having a bottom surface and a sidewall connected to the bottom surface, and an appearance membrane located on a side of the housing base. A bending angle between the sidewall and the bottom surface is greater than 70 degrees. The appearance membrane includes a soft substrate and a glossy silver layer located on a side of the soft substrate. The soft substrate has an elastic modulus in a range of 800 Mpa to 2000 Mpa.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Inventors: Xin Wu, Sipeng Bi, Tibo Hou
  • Patent number: 10966333
    Abstract: This application provides a method of manufacturing a case, a case and an electronic device. This method may include providing a metal case with a surface; applying a first oxidation treatment on the surface of the metal case to form a first oxidation layer; defining a first area on the surface; removing a portion of the first oxidation layer located within the first area; applying a second oxidation treatment on the surface within the first area to form a second oxidation layer, and forming a paint layer on the second oxidation layer by spraying.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: March 30, 2021
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Mingren Chen, Tibo Hou
  • Publication number: 20200412855
    Abstract: A housing assembly, a method for manufacturing the housing assembly, and an electronic device are provided according to the present disclosure. The housing assembly includes a housing body and a flexible film layer. The housing body has a bottom portion and at least one side wall connected with an outer edge of the bottom portion, and each of the at least one side wall and the bottom portion cooperatively define a bending angle larger than 70 degrees. The flexible film layer is disposed on a first surface of the housing body, and the flexible film layer has an elongation at break higher than or equal to 150%.
    Type: Application
    Filed: June 11, 2020
    Publication date: December 31, 2020
    Inventors: Sipeng Bi, Guangming Yang, Tibo Hou
  • Publication number: 20190104628
    Abstract: This application provides a method of manufacturing a case, a case and an electronic device. This method may include providing a metal case with a surface; applying a first oxidation treatment on the surface of the metal case to form a first oxidation layer; defining a first area on the surface; removing a portion of the first oxidation layer located within the first area; applying a second oxidation treatment on the surface within the first area to form a second oxidation layer, and forming a paint layer on the second oxidation layer by spraying.
    Type: Application
    Filed: September 18, 2018
    Publication date: April 4, 2019
    Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Mingren CHEN, Tibo HOU