Patents by Inventor Tic Medina

Tic Medina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Techniques for glass attachment in an image sensor package
    Patent number: 8093092
    Abstract: A low-cost wafer-level packaging (WLP) method for attaching glass to optical image-sensor devices on a semiconductor wafer in order to increase the yield of image-sensor modules during later steps of assembly. One embodiment relates to applications with image-sensors (and microlenses) fabricated on a wafer. A glass wafer is singulated, aligned to mirror the die pattern on an image-sensor wafer, and then bonded to the image-sensor wafer such that optical adhesive forms a layer between the each image-sensor and its glass cover. Another embodiment applies cavity walls to singulated glass covers, which are then attached to image sensors which may be formed on a single wafer. The wafer can then be singulated and a plurality of image sensor packages is formed.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: January 10, 2012
    Assignee: Flextronics AP, LLC
    Inventors: Harpuneet Singh, Liqun Larry Wang, Tic Medina
  • Techniques for Glass Attachment in an Image Sensor Package
    Publication number: 20100105160
    Abstract: A low-cost wafer-level packaging (WLP) method for attaching glass to optical image-sensor devices on a semiconductor wafer in order to increase the yield of image-sensor modules during later steps of assembly. One embodiment relates to applications with image-sensors (and microlenses) fabricated on a wafer. A glass wafer is singulated, aligned to mirror the die pattern on an image-sensor wafer, and then bonded to the image-sensor wafer such that optical adhesive forms a layer between the each image-sensor and its glass cover. Another embodiment applies cavity walls to singulated glass covers, which are then attached to image sensors which may be formed on a single wafer. The wafer can then be singulated and a plurality of image sensor packages is formed.
    Type: Application
    Filed: July 14, 2009
    Publication date: April 29, 2010
    Inventors: Harpuneet Singh, Liqun Larry Wang, Tic Medina
  • Automated ball mounting process and system with solder ball testing
    Patent number: 7392924
    Abstract: An automated ball mounting system is disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: July 1, 2008
    Assignee: Integrated Device Technology, Inc.
    Inventors: Kong Lam Song, Peng Cheong Choe, Tic Medina
  • Automated ball mounting process with solder ball testing
    Patent number: 7390122
    Abstract: An automated ball mounting process is disclosed in which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: June 24, 2008
    Assignee: Integrated Device Technology, Inc.
    Inventors: Kong Lam Song, Peng Cheong Choe, Tic Medina
  • Automated Ball Mounting Process with Solder Ball Testing
    Publication number: 20080101433
    Abstract: An automated ball mounting process is disclosed in which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.
    Type: Application
    Filed: October 31, 2007
    Publication date: May 1, 2008
    Inventors: Kong Song, Peng Choe, Tic Medina
  • Automated ball mounting process and system with solder ball testing
    Publication number: 20050279813
    Abstract: An automated ball mounting process and system are disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.
    Type: Application
    Filed: November 16, 2004
    Publication date: December 22, 2005
    Inventors: Kong Song, Peng Choe, Tic Medina