Patents by Inventor Tich Duy NGUYEN

Tich Duy NGUYEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230357930
    Abstract: The present description concerns a support (54) for semiconductor substrates (26) comprising an assembly of trays (58A, 58B, 58C, 58D) having the semiconductor substrates resting thereon. Each tray is made of an electrically-conductive material and has at least one substantially vertical surface having locations arranged in at least two horizontally-oriented rows and two vertically-oriented columns. Each location receives a semiconductor substrate oriented with an inclination relative to a vertical direction varying from 1° to 10°. Each tray comprises, at each location, a recess or a cavity covered with the substrate (56). The trays of each pair of trays facing each other are separated by electrically-insulating spacers (60).
    Type: Application
    Filed: September 17, 2021
    Publication date: November 9, 2023
    Inventors: Bachir SEMMACHE, Guy LAZZARELLI, Tich Duy NGUYEN