Abstract: Wafer-level package devices are described that include multiple die packaged into a single wafer-level package device. In an implementation, a wafer-level package device includes a semiconductor device having at least one electrical interconnection formed therein. At least one semiconductor package device is positioned over the first surface of the semiconductor device. The semiconductor package device includes one or more micro-solder bumps. The wafer-level package device further includes an encapsulation structure disposed over and supported by the semiconductor device for encapsulating the semiconductor package device(s). When the semiconductor package device is positioned over the semiconductor device, each micro-solder bump is connected to a respective electrical interconnection that is formed in the semiconductor device.

Abstract: A WLP device is provided with a flange shaped UBM or an embedded partial solder ball UBM on top of a copper post style circuit connection.

Abstract: A fuel cell hydration system comprising a first reservoir is provided. The first reservoir is positioned between a cathode supply and a fuel cell stack. The first reservoir includes corrugated regions positioned axially along the first reservoir to accumulate water discharged from a first fluid stream. The first fluid stream absorbs the accumulated water when an amount of water within the first fluid stream is below a water level to hydrate the fuel cell stack.

Abstract: A WLP device is provided with a flange shaped UBM or an embedded partial solder ball UBM on top of a copper post style circuit connection.

Abstract: A WLP device is provided with a flange shaped UBM or an embedded partial solder ball UBM on top of a copper post style circuit connection.

Abstract: A fuel cell system may have at least one sensor including a pair of electrodes disposed on a substrate. The sensor may be configured to produce an output signal having a magnitude that is proportional to a relative humidity in a vicinity of the sensor and, if liquid water is on the sensor, proportional to an amount of the liquid water on the sensor.

Abstract: A fuel cell hydration system comprising a first reservoir is provided. The first reservoir is positioned between a cathode supply and a fuel cell stack. The first reservoir includes corrugated regions positioned axially along the first reservoir to accumulate water discharged from a first fluid stream. The first fluid stream absorbs the accumulated water when an amount of water within the first fluid stream is below a water level to hydrate the fuel cell stack.

Abstract: A method for fabricating a semiconductor package with a substrate in a strip format is provided. Semiconductor devices are attached in a strip format to the substrate, and a thermal interface material is applied to the semiconductor devices. A flat panel heat spreader is attached to each semiconductor device. The semiconductor devices are encapsulated with open encapsulation, leaving the surface of the flat panel heat spreader opposite the substrate externally exposed. Individual semiconductor packages are then singulated from the strip format.

Abstract: A method for joining a semiconductor integrated circuit (IC) chip in a flip chip configuration, via pillar bump, to solderable metal contact pads, leads or circuit lines on the ciruitized surface of a chip carrier, as well as the resulting chip package, are disclosed. The semiconductor device is attached to the substrate via no flow underfill under thermal compression bonding. Integration of this structure and assembly method enables to incorporate low coefficient of thermal expansion (CTE) no flow underfill and achieve high assembly yield, especially for lead free bumps. The present invention provides a solution for a flip chip package with fine pitch, high pin count and lead free requirements.

Abstract: A method for fabricating a semiconductor package with a substrate in a strip format is provided. Semiconductor devices are attached in a strip format to the substrate, and a thermal interface material is applied to the semiconductor devices. A flat panel heat spreader is attached to each semiconductor device. The semiconductor devices are encapsulated with open encapsulation, leaving the surface of the flat panel heat spreader opposite the substrate externally exposed. Individual semiconductor packages are then singulated from the strip format.

Abstract: A method for joining a semiconductor integrated circuit (IC) chip in a flip chip configuration, via pillar bump, to solderable metal contact pads, leads or circuit lines on the ciruitized surface of a chip carrier, as well as the resulting chip package, are disclosed. The semiconductor device is attached to the substrate via no flow underfill under thermal compression bonding. Integration of this structure and assembly method enables to incorporate low coefficient of thermal expansion (CTE) no flow underfill and achieve high assembly yield, especially for lead free bumps. The present invention provides a solution for a flip chip package with fine pitch, high pin count and lead free requirements.

Abstract: Isolated nucleic acid molecules are provided that encode maize glutamine:fructose-6-phosphate amidotransferase (GFAT) and variant GFAT proteins. These nucleic acid molecules can be used to produce transgenic plants that synthesize cationic starch. Also provided are vectors capable of expressing such nucleic acid molecules, host cells containing such vectors, and polypeptides encoded by such nucleic acids.

Abstract: An improved underfill adhesive encapsulant with fluxing activities containing an epoxy resin or a mixture of epoxy resin. An anhydride is used as the curing agent to harden the epoxy resin. A hydroxyl-containing fluxing precursor compound is added to the encapsulant composition to react with the anhydride curing agent to produce an active fluxing agent under typical reflow conditions. The use of a fluxing precursor gives improved reliability compared to conventional fluxing agents used in existing no-flow underfill encapsulants. A suitable catalyst such as imidazole, imidazole derivative or metal acetylacetonate is provided in the present encapsulant at concentrations that give good curing kinetics. A thermoplastic is optionally included to allow the cured encapsulant to be reworked.

Abstract: In a no-flow underfill process 400, a substrate 10 is heated to an elevated temperature prior to dispensing underfill 5 thereon. The underfill 5 flows more readily over mask portions 20 and conductors 25 on the substrate 10, filling in spaces between the conductors 25 and the masking portions 20, thereby preventing air from being trapped thereabout. In addition, when a bumped die 40 is heated during placement on the substrate 10 with the underfill 5 therebetween, the underfill 5 flows around bumps 45 more readily thereby preventing air from being trapped thereabout. The result is a flip chip semiconductor package having a lower void density.

Abstract: A gas sensor deterioration monitor, particularly suited for use in an exhaust stream from an internal combustion engine. Under certain engine operating conditions, the output signal from the sensor is transformed through a Fourier Transformation into a frequency domain signal. Ratios of the magnitudes of certain odd and even harmonics are compared to corresponding reference values for a new sensor. Deviations beyond certain limits indicate a sensor that has deteriorated substantially.

Abstract: The present invention relates to a compound according to formula (1) wherein n is 0, 2, 4 or 6 and a, b and c are, independently of one another, 1 or 0. R1-1a, R1-1b and R1-1c are hydrogen, a hydrocarbyl containing 1 to 10 carbon atoms which are alkyl, aryl, alkylene, arylalkyl or alkylaryl or a hydrocarbyl containing 1 to 10 carbon atoms and at least one heteroatom which can be oxygen, sulfur or nitrogen. R2-1a, R3-1a, R4-1a, R5-1a, R2-1b, R3-1b, R4-1b, R5-1b, R2-1c, R3-1c, R4-1c and R5-1c hydrogen or C1-C4alkyl. R6-1a, R7-1a, R6-1b, R7-1b, R6-1c and R7-1c are C1-C4akyl. A is an aromatic or alicyclic ring having 5 to 7 carbon atoms. The present invention further relates to a Mannich base reaction product obtained by combining an extract from cashew nutshell liquid with at least one aromatic or alicylic polyamine and at least one aldehyde compound, epoxy resin compositions and curable formulations containing the same, and methods for using such compositions.

Abstract: The present invention relates to an improved oxygen sensor and particularly to oxygen sensors used as exhaust sensors in vehicles. The oxygen sensor, which has an improved lean-rich response time and operability at lower temperatures, has been chemically etched and electrically treated, or chemically etched with a non-hydrofluoric acid solution.