Patents by Inventor Tiecheng Liang

Tiecheng Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166436
    Abstract: Methods, apparatuses, systems, assemblies, and/or the like are provided. An example shuttle car assembly may include a shuttle car body configured to support one or more objects. The shuttle car body includes a chassis, one or more wheels connected to the chassis, one or more operating components connected to the chassis, one or more toolless body attachments. The shuttle car assembly may also include a shuttle car housing configured to at least partially house the one or more operating components of the shuttle car body. The shuttle car housing may include a shell with a top surface, a front surface, and two opposed side surfaces, and one or more toolless housing attachments. The one or more toolless body attachments and the one or more toolless housing attachments may be configured to engage to operatively connect the shuttle car body and the shuttle car housing.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 23, 2024
    Inventors: Liangqi LIANG, Tiecheng QU, Baoguo WU, Xiaojun MA, Zhao Xia JIN, Kian Weng TEH
  • Patent number: 9301395
    Abstract: Disclosed are methods and systems to reduce voltage noise on a printed circuit board (PCB) through a co-layout of multilayer ceramic capacitors. In one or more embodiments, this surface mounted layout comprises a first co-layout of multilayer ceramic capacitors mounted on a first corner of a rectangular footprint of a bottom side of the PCB; a second co-layout of multilayer ceramic capacitors mounted on a second corner of the rectangular footprint diagonal to the first corner; and a first solid electrolytic polymer capacitor and a second solid electrolytic polymer capacitor mounted on the remaining corners, respectively, of the rectangular footprint. The rectangular footprint of the PCB is a footprint of a high-speed processing unit mounted on the PCB. The high-speed processing unit is mounted on a top side of the PCB opposite the bottom side comprising the first co-layout of multilayer ceramic capacitors and the second co-layout of multilayer ceramic capacitors.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: March 29, 2016
    Assignee: NVIDIA Corporation
    Inventor: Tiecheng Liang
  • Patent number: 9152372
    Abstract: A method and system for enabling multiple video graphics array (VGA) cards to process image data are disclosed. Specifically, one embodiment of a graphics system includes a first video graphics array (VGA) card having a first and a second connection ports, a second VGA card having a first and a second connection ports, a third VGA card having a first and a second connection ports, and a connecting device for electronically connecting the first, the second, and the third VGA cards via connections that transfer data. The connecting device is further configured to connect the first connection port of the first VGA card to either the first or the second connection port of the second VGA card and connect the second connection port of the first VGA card to either the first or the second connection port of the third VGA card.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: October 6, 2015
    Assignee: NVIDIA CORPORATION
    Inventor: Tiecheng Liang
  • Publication number: 20140223236
    Abstract: A device for testing a graphics card is presented. The device includes a core test apparatus. The core test apparatus includes a processor configured to perform a test operation on a graphics card and a power interface for transferring electric energy to the core test apparatus. Using the device for testing a graphics card provided by the present invention makes a graphics card test easier and more efficient.
    Type: Application
    Filed: February 7, 2014
    Publication date: August 7, 2014
    Applicant: NVIDIA Corporation
    Inventors: Dongbo HAO, Tiecheng LIANG, Jie ZHOU
  • Publication number: 20140185207
    Abstract: Disclosed are methods and systems to reduce voltage noise on a printed circuit board (PCB) through a co-layout of multilayer ceramic capacitors. In one or more embodiments, this surface mounted layout comprises a first co-layout of multilayer ceramic capacitors mounted on a first corner of a rectangular footprint of a bottom side of the PCB; a second co-layout of multilayer ceramic capacitors mounted on a second corner of the rectangular footprint diagonal to the first corner; and a first solid electrolytic polymer capacitor and a second solid electrolytic polymer capacitor mounted on the remaining corners, respectively, of the rectangular footprint. The rectangular footprint of the PCB is a footprint of a high-speed processing unit mounted on the PCB. The high-speed processing unit is mounted on a top side of the PCB opposite the bottom side comprising the first co-layout of multilayer ceramic capacitors and the second co-layout of multilayer ceramic capacitors.
    Type: Application
    Filed: December 27, 2012
    Publication date: July 3, 2014
    Inventor: Tiecheng Liang
  • Publication number: 20090141467
    Abstract: A method and system for enabling multiple video graphics array (VGA) cards to process image data are disclosed. Specifically, one embodiment of a graphics system includes a first video graphics array (VGA) card having a first and a second connection ports, a second VGA card having a first and a second connection ports, a third VGA card having a first and a second connection ports, and a connecting device for electronically connecting the first, the second, and the third VGA cards via connections that transfer data. The connecting device is further configured to connect the first connection port of the first VGA card to either the first or the second connection port of the second VGA card and connect the second connection port of the first VGA card to either the first or the second connection port of the third VGA card.
    Type: Application
    Filed: December 13, 2007
    Publication date: June 4, 2009
    Inventor: Tiecheng Liang