Patents by Inventor Tiejun HU

Tiejun HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12256902
    Abstract: A method includes generating thermal energy at a distal end of an elongate member and transferring the thermal energy between the elongate member and a housing coupled to a proximal end of the elongate member by activating a heat pump device thermally coupled between the elongate member and the housing. The heat pump device is disposed at least partially outside the housing. In some examples, a plurality of heat pump devices each located at least partially outside the housing and along a heat path formed between the distal end of the elongate member and the housing may be activated.
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: March 25, 2025
    Assignee: INTUITIVE SURGICAL OPERATIONS, INC.
    Inventors: Anqi Fan, Tiejun Hu
  • Publication number: 20250087869
    Abstract: An electronic device may be provided with sidewalls and a conductive plate. A segment of the sidewalls may form a radiating arm of an antenna. A display may be mounted to the sidewalls. The display may include a conductive frame and a flexible printed circuit. The flexible circuit may have a bend. Conductive foam may short a conductive trace on the flexible circuit to the conductive frame near the bend. Low injection pressure overmolding (LIPO) may be molded over the flexible circuit, the foam, and the frame. A conductive spring may short the frame to the conductive plate. The spring may include a wider and/or thinner portion that optionally includes one or more notches for reducing its inductance. The conductive plate, the spring, the frame, the foam, and the conductive trace may form part of the antenna ground for the antenna.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 13, 2025
    Inventors: Ming Chen, Enrique Ayala Vazquez, Joel Ravi, Woonyong Bae, Laura M Burke, Yuancheng Xu, Bhaskara R Rupakula, Haozhan Tian, Salih Yarga, Erdinc Irci, Tiejun Yu, Seyed Mohammad Amjadi, Ahmed Ali Abdelhaliem Nafe, Hongfei Hu, Carlo Di Nallo, Mattia Pascolini
  • Publication number: 20250087890
    Abstract: An electronic device may be provided with wireless circuitry and a housing having peripheral conductive housing structures. The wireless circuitry may include first and second antennas. The first antenna may have a resonating element arm formed from a first segment of the peripheral conductive housing structures. The second antenna may have a resonating element arm formed from a second segment of the peripheral conductive housing structures separated from the first segment by a gap. Switchable short paths may be coupled between the second segment and ground on opposing sides of an antenna feed for the second antenna and/or may be coupled between the first and second segments and ground on opposing sides of the gap. Additionally or alternatively, a switch may be coupled between the first and second segments across the gap and a tuning component may couple the second segment to the ground structures.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 13, 2025
    Inventors: Ahmed Ali Abdelhaliem Nafe, Ali Pourghorban Saghati, Ana Papio Toda, Carlo Di Nallo, Enrique Ayala Vazquez, Erdinc Irci, Hao Xu, Hongfei Hu, Jingni Zhong, Mattia Pascolini, Ming Chen, Mohsen Salehi, Nikolaj P Kammersgaard, Orbay Tuncay, Salih Yarga, Seyed Mohammad Amjadi, Tiejun Yu, Yiren Wang, Yuan Tao
  • Publication number: 20230363631
    Abstract: A method and apparatus for improving a heat dissipation capacity. An apparatus comprises an elongate member, a housing, and a heat pump device. The elongate member has a distal end and a proximal end. The housing is coupled to the proximal end of the elongate member. The heat pump device is coupled between the elongate member and the housing. The heat pump device is configured to transfer thermal energy between the elongate member and the housing.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 16, 2023
    Inventors: Anqi Fan, Tiejun Hu
  • Patent number: 11744448
    Abstract: A method and apparatus for improving a heat dissipation capacity. An apparatus comprises an elongate member, a housing, and a heat pump device. The elongate member has a distal end and a proximal end. The housing is coupled to the proximal end of the elongate member. The heat pump device is disposed between the proximal end of the elongate member and the housing. The heat pump device is disposed at least partially outside the housing and is configured to transfer thermal energy between the elongate member and the housing. The heat pump device has a maximum outer diameter that is greater than a maximum outer diameter of the elongate member.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: September 5, 2023
    Assignee: INTUITIVE SURGICAL OPERATIONS, INC.
    Inventors: Anqi Fan, Tiejun Hu
  • Publication number: 20200077879
    Abstract: A method and apparatus for improving a heat dissipation capacity. An apparatus comprises an elongate member, a housing, and a heat pump device. The elongate member has a distal end and a proximal end. The housing is coupled to the proximal end of the elongate member. The heat pump device is coupled between the elongate member and the housing. The heat pump device is configured to transfer thermal energy between the elongate member and the housing.
    Type: Application
    Filed: May 8, 2018
    Publication date: March 12, 2020
    Applicant: INTUITIVE SURGICAL OPERATIONS, INC.
    Inventors: Anqi FAN, Tiejun HU
  • Patent number: D1061854
    Type: Grant
    Filed: June 23, 2024
    Date of Patent: February 11, 2025
    Assignee: Shenzhen Xiaohei Technology Electronics Co., Ltd.
    Inventors: Changcai Hu, Tiejun Xu