Patents by Inventor Tiejun HU

Tiejun HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12107335
    Abstract: An electronic device may have peripheral conductive housing structures, a display frame, a support plate, a logic board, and an antenna. The antenna may have a resonating element that includes a first slot between the logic board and a segment of the peripheral conductive housing structures, a second slot between the display frame and the segment, and optionally a third slot between the support plate and the segment. The slots may be at least partially overlapping, may have respective lengths, may be located at respective distances from a cover layer for the display, and may collectively receive radio-frequency signals in a frequency band such as the L5 GPS band. Switching circuitry and filter circuitry may be coupled to the antenna feed and/or to the antenna feed (s) of one or more adjacent antennas in the electronic device to help to isolate the antennas from each other.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: October 1, 2024
    Assignee: Apple Inc.
    Inventors: Aobo Li, Erdinc Irci, Carlo Di Nallo, Enrique Ayala Vazquez, Haozhan Tian, Hongfei Hu, Liang Han, Ming Chen, Ming-Ju Tsai, Salih Yarga, Tiejun Yu, Victor C Lee, Xu Han
  • Publication number: 20230363631
    Abstract: A method and apparatus for improving a heat dissipation capacity. An apparatus comprises an elongate member, a housing, and a heat pump device. The elongate member has a distal end and a proximal end. The housing is coupled to the proximal end of the elongate member. The heat pump device is coupled between the elongate member and the housing. The heat pump device is configured to transfer thermal energy between the elongate member and the housing.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 16, 2023
    Inventors: Anqi Fan, Tiejun Hu
  • Patent number: 11744448
    Abstract: A method and apparatus for improving a heat dissipation capacity. An apparatus comprises an elongate member, a housing, and a heat pump device. The elongate member has a distal end and a proximal end. The housing is coupled to the proximal end of the elongate member. The heat pump device is disposed between the proximal end of the elongate member and the housing. The heat pump device is disposed at least partially outside the housing and is configured to transfer thermal energy between the elongate member and the housing. The heat pump device has a maximum outer diameter that is greater than a maximum outer diameter of the elongate member.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: September 5, 2023
    Assignee: INTUITIVE SURGICAL OPERATIONS, INC.
    Inventors: Anqi Fan, Tiejun Hu
  • Publication number: 20200077879
    Abstract: A method and apparatus for improving a heat dissipation capacity. An apparatus comprises an elongate member, a housing, and a heat pump device. The elongate member has a distal end and a proximal end. The housing is coupled to the proximal end of the elongate member. The heat pump device is coupled between the elongate member and the housing. The heat pump device is configured to transfer thermal energy between the elongate member and the housing.
    Type: Application
    Filed: May 8, 2018
    Publication date: March 12, 2020
    Applicant: INTUITIVE SURGICAL OPERATIONS, INC.
    Inventors: Anqi FAN, Tiejun HU