Patents by Inventor Tieming Luo

Tieming Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240098047
    Abstract: In a group chat-based instant messaging method, a message is received from a first messaging application of a first user in a first messaging group. The first messaging application is associated with a first messaging service. When the message is to be announced to all group members of the first messaging group, whether the first user is authorized to send the message is determined based on identity information of the first user. Based on the first user being authorized, protocol conversion on the message is performed based on a second messaging protocol of a second messaging service to output the message in a first preset announcement style for messages announced to all group members. The converted message is transmitted, via a second messaging server, to a second messaging application corresponding to one of the plurality of group members in the first messaging group.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Tieming HUANG, Bin LI, Li LIN, Yijun LUO, Tanglei PAN
  • Patent number: 7820920
    Abstract: The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the circuit board. The casing comprises a hollow body provided with at least one opening.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: October 26, 2010
    Assignee: Raychem Electronics (Shanghai) Ltd.
    Inventors: Yong Dong, Jiebing Pan, Tieming Luo
  • Publication number: 20090078460
    Abstract: The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the circuit board. The casing comprises a hollow body provided with at least one opening.
    Type: Application
    Filed: September 17, 2008
    Publication date: March 26, 2009
    Applicant: Raychem Electronics (Shanghai) Ltd.
    Inventors: Yong Dong, Jiebing Pan, Tieming Luo