Abstract: A heat dissipation gate control system includes a magnetic element, an electromagnetic element and an elastic element. The magnetic element is coupled to a heat dissipation gate. The electromagnetic element is provided for generating a magnetic force to enable the magnetic element to drive the heat dissipation gate open. The elastic element has an end coupled to the heat dissipation gate and applies an elastic force to the heat dissipation gate to enable the heat dissipation gate closed when the electromagnetic element stops generating the magnetic force for the magnetic element. A method of controlling a heat dissipation gate is also disclosed herein.

Abstract: A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion that defines an arch chamber that accommodates the second end of the heat pipe, two press portions respectively extended from two opposite lateral sides of the protruded arch portion and pressed on the top surface of the thermal chip, and a plurality of hook portions respectively extended from the press portions and hooked on the bottom edge of the circuit board.