Abstract: A chip package fabricating kit includes a metal cover, at least one screw, and at least one screw cap. The metal cover includes a cap portion and at least one leg. The cap portion substantially presses against the BGA package. The leg substantially presses a PCB board that loads the BGA package. The leg forms a concave space with the metal cover for substantially encompassing the BGA package. Each the screw screws through a corresponding leg from top to bottom. Each the screw screws the PCB board at a first side. The screw cap respectively corresponds to the screw and one leg. The screw cap caps and fixes a tail of its corresponding screw for affixing the PCB board. A height of the concave space is dynamically adjusted by adjusting a degree that the screw screws with the screw cap. Such that the concave space substantially clamps the BGA package.

Abstract: A probe card includes a circuit board and a probe set. The probe set is electrically coupled to the circuit board. Also, the probe set includes a plurality of probes. Each of the plurality of probes includes a plurality of nanotwinned copper pillars that are arranged in a predetermined crystal orientation. In addition, each of the plurality of probes further includes a tip. The tip substantially and electrically contacts a chip. Such that the circuit board can test the chip via the tip.

Abstract: A semiconductor package is disclosed for efficiently facilitating heat dissipation. The semiconductor package includes a substrate layer, a chip, a housing lid and thermal-conductive liquid. A chip is disposed on the substrate layer and electrically coupled to the substrate layer. The chip includes at least one through silicon via (TSV). The housing lid is disposed above both the substrate layer and the chip. Also, the housing lid is coupled to the substrate layer at its edge for forming an internal space that encompasses the chip. The thermal-conductive liquid is filled within the internal space.

Abstract: A chip package fabricating kit includes a metal cover, at least one screw, and at least one screw cap. The metal cover includes a cap portion and at least one leg. The cap portion substantially presses against the BGA package. The leg substantially presses a PCB board that loads the BGA package. The leg forms a concave space with the metal cover for substantially encompassing the BGA package. Each the screw screws through a corresponding leg from top to bottom. Each the screw screws the PCB board at a first side. The screw cap respectively corresponds to the screw and one leg. The screw cap caps and fixes a tail of its corresponding screw for affixing the PCB board. A height of the concave space is dynamically adjusted by adjusting a degree that the screw screws with the screw cap. Such that the concave space substantially clamps the BGA package.

Abstract: A probe card includes a circuit board and a probe set. The probe set is electrically coupled to the circuit board. Also, the probe set includes a plurality of probes. Each of the plurality of probes includes a plurality of nanotwinned copper pillars that are arranged in a predetermined crystal orientation. In addition, each of the plurality of probes further includes a tip. The tip substantially and electrically contacts a chip. Such that the circuit board can test the chip via the tip.

Abstract: A semiconductor package is disclosed for efficiently facilitating heat dissipation. The semiconductor package includes a substrate layer, a chip and a housing lid. The chip is disposed on the substrate layer. Also, the chip is electrically coupled to the substrate layer. Additionally, the chip is smaller than the substrate layer in area. The housing lid is disposed above the chip. Moreover, the housing lid covers the chip and the substrate layer. The housing lid, the chip and the substrate layer form an internal space. The internal space fills with a thermal interface material.

Abstract: An antenna assembly includes an electrical device (20) and an antenna coating (10). The electrical device includes a circuit board(22), an insulative cover (11) and a connection portion (24) pivotally interconnecting the circuit board and the insulative cover. The antenna coating is formed on the insulative cover and substantially covers the connection portion, thereby establishing electrical connection with the circuit board via the connection portion. By pivotally rotating the insulative cover on the electrical device, the antenna performance can be improved. Because the antenna coating is directly formed on the insulative cover of the electrical device, the antenna assembly has a simple structure.

Abstract: An antenna assembly includes an electrical device (20) and an antenna coating (10). The electrical device includes a circuit board(22), an insulative cover (11) and a connection portion (24) pivotally interconnecting the circuit board and the insulative cover. The antenna coating is formed on the insulative cover and substantially covers the connection portion, thereby establishing electrical connection with the circuit board via the connection portion. By pivotally rotating the insulative cover on the electrical device, the antenna performance can be improved. Because the antenna coating is directly formed on the insulative cover of the electrical device, the antenna assembly has a simple structure.