Patents by Inventor Tien-Chun Feng

Tien-Chun Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110157835
    Abstract: A heat sink assembly is provided. The heat sink assembly comprises a heat sink and a clip. The heat sink comprises a heat-dissipating baseboard and a plurality of heat-dissipating plates. The heat-dissipating baseboard is adapted to a heating element. The heat-dissipating plates are formed perpendicularly on the heat-dissipating baseboard and parallel to each other. The clip comprises a central portion, two winding portions and two locking portions. The central portion is placed in a containing space between two of the heat-dissipating plates and is riveted on the heat-dissipating baseboard. The length of the central portion is substantially the same as the length of the heating element. The winding portions are connected to the two ends of the central portion respectively and aren't contacted to the heat-dissipating baseboard. The locking portions are formed substantially perpendicularly on the two winding portions and each has a hook stretching out in opposite directions.
    Type: Application
    Filed: March 9, 2010
    Publication date: June 30, 2011
    Applicant: Quanta Computer Inc.
    Inventors: Tien-Chun Feng, Chao-Jung Chen, Wen-Liang Huang