Patents by Inventor Tien-Daht Nguyen

Tien-Daht Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Home filling method using estimated spatio-temporal background information, and recording medium and apparatus for performing the same
    Patent number: 10497166
    Abstract: Provided are a hole filling method using estimated spatio-temporal background information and a recording medium and apparatus for performing the same. The present disclosure is providing a hole filling method using estimated spatio-temporal background information, the hole filling method being capable of estimating temporal background information, estimating spatial background information, and merging the temporal background information and the spatial background information to perform a hole filling process, and a recording medium and apparatus for performing the same.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: December 3, 2019
    Assignee: FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION
    Inventors: Min-Cheol Hong, Beomsu Kim, Tien-Daht Nguyen
  • HOLE FILLING METHOD USING ESTIMATED SPATIO-TEMPORAL BACKGROUND INFORMATION, AND RECORDING MEDIUM AND APPARATUS FOR PERFORMING THE SAME
    Publication number: 20180357813
    Abstract: Provided are a hole filling method using estimated spatio-temporal background information and a recording medium and apparatus for performing the same. The present disclosure is providing a hole filling method using estimated spatio-temporal background information, the hole filling method being capable of estimating temporal background information, estimating spatial background information, and merging the temporal background information and the spatial background information to perform a hole filling process, and a recording medium and apparatus for performing the same.
    Type: Application
    Filed: September 20, 2017
    Publication date: December 13, 2018
    Inventors: Min-Cheol HONG, Beomsu KIM, Tien-Daht Nguyen