Patents by Inventor Tien Dat NGUYEN

Tien Dat NGUYEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11776191
    Abstract: The invention presents a system and a method for 3D human reconstruction using a compact kit of depth cameras. Instead of using complex and expensive devices as in traditional methods, the proposed system and method employs a simple, easy-to-install system to accurately collect the human body shape. The generated model is capable of moving thanks to a skeleton system simulating the human skeleton. The proposed system includes four blocks: Data Collection Block, Point Cloud Standardization Block, Human Digitization Block and Output Block. The proposed method includes five steps: Point Cloud Collecting, Point Cloud Filtering, Point Cloud Calibrating, Point Cloud Optimizing and 3D Human Model Generating.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: October 3, 2023
    Assignee: VIETTEL GROUP
    Inventors: Van Duc Tran, Tien Dat Nguyen, Hai Anh Nguyen, Anh Tra Duong
  • Publication number: 20230033542
    Abstract: The invention presents a system and a method for 3D human reconstruction using a compact kit of depth cameras. Instead of using complex and expensive devices as in traditional methods, the proposed system and method employs a simple, easy-to-install system to accurately collect the human body shape. The generated model is capable of moving thanks to a skeleton system simulating the human skeleton. The proposed system includes four blocks: Data Collection Block, Point Cloud Standardization Block, Human Digitization Block and Output Block. The proposed method includes five steps: Point Cloud Collecting, Point Cloud Filtering, Point Cloud Calibrating, Point Cloud Optimizing and 3D Human Model Generating.
    Type: Application
    Filed: May 18, 2022
    Publication date: February 2, 2023
    Applicant: VIETTEL GROUP
    Inventors: Van Duc Tran, Tien Dat Nguyen, Hai Anh Nguyen, Anh Tra Duong
  • Publication number: 20230005231
    Abstract: The Invention presents a system and a method for digitizing a human body shape from anthropometrical measurements. The proposed system and method allow reconstructing the 3D human body quickly and accurately, improving disadvantages of costly and timely traditional methods, which not only requires digitized persons to be naked or wear tight clothes but also could use hazardous lights to their health. The system in the invention includes two main modules and two supplementary blocks to reconstruct the 3D human body from anthropometric measurements, which are: (1) Input Block, (2) Pre-Processing Module, (3) Optimization Module, (4) Output Block. The method in the invention includes four steps: (1) Step 1a: collecting human body measurements, (2) Steps 1b: Initial Population; (3) Step 2: Optimizing; (4) Step 3: Displaying digitized human body shape.
    Type: Application
    Filed: January 4, 2022
    Publication date: January 5, 2023
    Applicant: VIETTEL GROUP
    Inventors: Ngoc Thach Hoang, Tien Dat Nguyen
  • Publication number: 20210375045
    Abstract: The invention presents a system and a method for digitizing body shape from dressed human image using machine learning and optimization techniques. The invention is able to rapidly and accurately reconstruct human body shape without using costly, bulky and hazardous 3D scanners. Firstly, the system reconstructing human body shape from the dressed human image includes 2 main modules and 2 supplementary blocks, which are: (1) Input Block, (2) Pre-Processing Module, (3) Optimization Module, (4) Output Block. In which, the Pre-Processing Module comprises 4 blocks: (1) Image Standardization, (2) Clothes Classification and Segmentation, (3) Human Pose Estimation, (4) Cloth-Skin Displacement Model. The Optimization Modules comprises 2 blocks: (1) Human Parametric Model, (2) Human Parametric Optimization.
    Type: Application
    Filed: December 8, 2020
    Publication date: December 2, 2021
    Applicant: VIETTEL GROUP
    Inventors: Xuan Canh Cao, Tien Dat Nguyen, Hai Anh Nguyen, Van Duc Tran
  • Publication number: 20210131767
    Abstract: The invention presents a system optimizing control coefficients of flight object under complex environmental effects using hybrid Fuzzy Logic and PID variant controller. The proposed system includes: target module, seeker module, guidance module, control module, dynamics module. The fuzzy logic controller is applied to determine the parameters coefficients of a proportional integral derivative (PID) based on the effect of these coefficients on the system response. The control module is less affected by the accuracy of the mathematical model and can perform well in environments with impact noise.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 6, 2021
    Applicant: VIETTEL GROUP
    Inventors: Van Duc Tran, Tien Dat Nguyen, Thi Anh Nguyen
  • Patent number: 9916694
    Abstract: Disclosed is a method for hole-filling in 3D models. The method includes extracting static background information from a current frame of an input image and extracting virtual static background information using the static background information, warping a color image and a depth map of the current frame to acquire a virtual image and a virtual depth map, and labeling a hole area formed in the virtual depth map to extract local background information, performing a first hole-filling onto the virtual image and the virtual depth map using a similarity between the virtual static background information and the local background information, and performing a second hole-filling with respect to remaining holes after the first hole-filling in a manner of an exemplar-based in-painting method to which a priority function including a depth term is applied.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: March 13, 2018
    Assignee: FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION
    Inventors: Min-Cheol Hong, Beomsu Kim, Tien-Dat Nguyen, Huu-Noi Doan
  • Patent number: 9851223
    Abstract: The present disclosure relates to a tactile sensor including a first substrate on which a first electrode is formed; a second substrate on which a second electrode and a coupling hole is formed so that the first electrode may be inserted into the coupling hole; and a dielectric covering the first electrode and the second electrode, and thus not only having flexibility and elasticity, but also requiring a reduced number of wires to be used when sending and receiving signals, making it is easier to manufacture and saving costs.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: December 26, 2017
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Hyouk Ryeol Choi, Tien Dat Nguyen, Junwoo Park, Hyoseung Han
  • Publication number: 20170263057
    Abstract: Disclosed is a method for hole-filling in 3D models. The method includes extracting static background information from a current frame of an input image and extracting virtual static background information using the static background information, warping a color image and a depth map of the current frame to acquire a virtual image and a virtual depth map, and labeling a hole area formed in the virtual depth map to extract local background information, performing a first hole-filling onto the virtual image and the virtual depth map using a similarity between the virtual static background information and the local background information, and performing a second hole-filling with respect to remaining holes after the first hole-filling in a manner of an exemplar-based in-painting method to which a priority function including a depth term is applied.
    Type: Application
    Filed: June 22, 2016
    Publication date: September 14, 2017
    Inventors: Min-Cheol HONG, Beomsu KIM, Tien-Dat NGUYEN, Huu-Noi DOAN
  • Publication number: 20170067757
    Abstract: The present disclosure relates to a tactile sensor including a first substrate on which a first electrode is formed; a second substrate on which a second electrode and a coupling hole is formed so that the first electrode may be inserted into the coupling hole; and a dielectric covering the first electrode and the second electrode, and thus not only having flexibility and elasticity, but also requiring a reduced number of wires to be used when sending and receiving signals, making it is easier to manufacture and saving costs.
    Type: Application
    Filed: September 9, 2016
    Publication date: March 9, 2017
    Applicant: Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Hyouk Ryeol CHOI, Tien Dat NGUYEN, Junwoo PARK, Hyoseung HAN