Patents by Inventor Tien-Hung Cheng

Tien-Hung Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20240047547
    Abstract: A semiconductor device includes a source via having a body portion and a barrier layer surrounding the body portion, and the body portion is in physical contact with the source contact. Furthermore, the barrier layer includes at least one sidewall section separating the source via from an adjacent via structure. As such, the via to via leakage may be prevented. Overall, by providing a semiconductor device having the above structures, the contact resistance is reduced, and the device performance is further improved.
    Type: Application
    Filed: August 2, 2022
    Publication date: February 8, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Chiang Tsai, Tien-Hung Cheng, Jeng-Ya Yeh, Mu-Chi Chiang