Abstract: An integrated heat dissipation module structure includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface having a plurality of columnar heat dissipation structures protruding therefrom and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves. The bottom cover includes oppositely an outer heat-absorption surface having screw holes for locking electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves, protrusive supporting structures disposed between the bottom grooves, and screw-hole protrusions corresponding to the screw holes. The capillary structures are disposed within the bottom grooves or both the bottom and top grooves. The working fluid is in the working space and the capillary structures.

Abstract: An integrated vapor chamber includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves and protrusive supporting structures. The bottom cover includes oppositely an outer heat-absorption surface having recessed spaces for accommodating electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves. The working space is an airtight space formed by engaging the top frame and the bottom frame with the inner condensation surface to face the inner evaporation surface, the top grooves to overlap individually the bottom grooves, the supporting structures to contact individually at the inner evaporation surface among the bottom grooves.

Abstract: A chip module with heat dissipation device includes device includes a chip unit, a heat dissipation body and a plurality of metal connecting elements. The heat dissipation body is disposed on the chip unit. The plurality of metal connecting elements formed by ultrasonic bonding are disposed between the chip unit and the heat dissipation body to connect the chip unit to the heat dissipation body.

Abstract: The present invention discloses a hybrid electrostatic headphone module, with the hybrid electrostatic headphone module disposed in the interior of a left and a right ear cup of a stereo headphones. The hybrid electrostatic headphone module is assembled as a single unit from a traditional moving coil type headphone unit and an electret headphone unit (E-STAT), which are respectively responsible for medium-low frequency bands and medium-high frequency bands. A frequency divider assembled from a frequency division capacitance and a drive transformer divides a complete signal into medium-high frequency and medium-low frequency bands, which are then respectively supplied to high and low frequency sound speakers for output therefrom.

Abstract: The present invention discloses a hybrid electrostatic headphone module, with the hybrid electrostatic headphone module disposed in the interior of a left and a right ear cup of a stereo headphones. The hybrid electrostatic headphone module is assembled as a single unit from a traditional moving coil type headphone unit and an electret headphone unit (E-STAT), which are respectively responsible for medium-low frequency bands and medium-high frequency bands. A frequency divider assembled from a frequency division capacitance and a drive transformer divides a complete signal into medium-high frequency and medium-low frequency bands, which are then respectively supplied to high and low frequency sound speakers for output therefrom.

Abstract: A heat dissipater for a CPU (Central Processing Unit) includes an upper plate and a lower plate abutting each other. The upper plate has a series of fins extending upwards from a first side of the upper plate and a recess defined in a second side of the upper plate. The lower plate includes a first side having a recess defined to correspond to the recess in the upper plate and forming a closed chamber with the recess in the upper plate and a second side adapted to abut the CPU. Volatile liquid is received in the closed chamber to promote the dissipating effect of the heat dissipater for a CPU. The upper and lower plates are integrally made and the only step of assembly is to securely combine the two plates together so that the manufacturing processing is simplified to save manufacturing time and cost.

Abstract: A heat dissipater for a CPU (Central Processing Unit) includes an upper block and a lower block abutting each other. The upper block has a series of fins extending upward from a first side of the upper block and a recess defined in a second side of the upper block. The lower block includes a first side having a recess defined to correspond to the recess in the upper block and forming a closed chamber with the recess in the upper block and a second side adapted to abut the CPU. Volatile liquid is received in the closed chamber to promote the heat dissipation of the heat dissipater for a CPU.