Abstract: A chip module with heat dissipation device includes device includes a chip unit, a heat dissipation body and a plurality of metal connecting elements. The heat dissipation body is disposed on the chip unit. The plurality of metal connecting elements formed by ultrasonic bonding are disposed between the chip unit and the heat dissipation body to connect the chip unit to the heat dissipation body.

Abstract: The present invention discloses a hybrid electrostatic headphone module, with the hybrid electrostatic headphone module disposed in the interior of a left and a right ear cup of a stereo headphones. The hybrid electrostatic headphone module is assembled as a single unit from a traditional moving coil type headphone unit and an electret headphone unit (E-STAT), which are respectively responsible for medium-low frequency bands and medium-high frequency bands. A frequency divider assembled from a frequency division capacitance and a drive transformer divides a complete signal into medium-high frequency and medium-low frequency bands, which are then respectively supplied to high and low frequency sound speakers for output therefrom.

Abstract: The present invention discloses a hybrid electrostatic headphone module, with the hybrid electrostatic headphone module disposed in the interior of a left and a right ear cup of a stereo headphones. The hybrid electrostatic headphone module is assembled as a single unit from a traditional moving coil type headphone unit and an electret headphone unit (E-STAT), which are respectively responsible for medium-low frequency bands and medium-high frequency bands. A frequency divider assembled from a frequency division capacitance and a drive transformer divides a complete signal into medium-high frequency and medium-low frequency bands, which are then respectively supplied to high and low frequency sound speakers for output therefrom.

Abstract: A heat dissipater for a CPU (Central Processing Unit) includes an upper plate and a lower plate abutting each other. The upper plate has a series of fins extending upwards from a first side of the upper plate and a recess defined in a second side of the upper plate. The lower plate includes a first side having a recess defined to correspond to the recess in the upper plate and forming a closed chamber with the recess in the upper plate and a second side adapted to abut the CPU. Volatile liquid is received in the closed chamber to promote the dissipating effect of the heat dissipater for a CPU. The upper and lower plates are integrally made and the only step of assembly is to securely combine the two plates together so that the manufacturing processing is simplified to save manufacturing time and cost.

Abstract: A heat dissipater for a CPU (Central Processing Unit) includes an upper block and a lower block abutting each other. The upper block has a series of fins extending upward from a first side of the upper block and a recess defined in a second side of the upper block. The lower block includes a first side having a recess defined to correspond to the recess in the upper block and forming a closed chamber with the recess in the upper block and a second side adapted to abut the CPU. Volatile liquid is received in the closed chamber to promote the heat dissipation of the heat dissipater for a CPU.