Patents by Inventor Tien-Lin WU

Tien-Lin WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10355226
    Abstract: The present disclosure relates to a boron-containing compound including a structure of Formula (I), and the use of the compound as a dopant in an emitting layer of an organic light emitting diode. The present disclosure also relates to an emitting layer of an organic light emitting diode and an organic light emitting diode device.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: July 16, 2019
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Tien-Lin Wu, Chih-Chun Lin, Rai-Shung Liu, Chien-Hong Cheng
  • Publication number: 20180013064
    Abstract: The present disclosure relates to a boron-containing compound including a structure of Formula (I), and the use of the compound as a dopant in an emitting layer of an organic light emitting diode. The present disclosure also relates to an emitting layer of an organic light emitting diode and an organic light emitting diode device.
    Type: Application
    Filed: November 3, 2016
    Publication date: January 11, 2018
    Inventors: Tien-Lin WU, Chih-Chun LIN, Rai-Shung LIU, Chien-Hong CHENG