Patents by Inventor Tien-Ming Lin
Tien-Ming Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240162094Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate, a conductive feature on the substrate, and an electrical connection structure on the conductive feature. The electrical connection includes a first grain made of a first metal material, and a first inhibition layer made of a second metal layer that is different than the first metal material. The first inhibition layer extends vertically along a first side of a grain boundary of the first grain and laterally along a bottom of the grain boundary of the first grain.Type: ApplicationFiled: January 5, 2024Publication date: May 16, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shih-Chuan CHIU, Jia-Chuan YOU, Chia-Hao CHANG, Chun-Yuan CHEN, Tien-Lu LIN, Yu-Ming LIN, Chih-Hao WANG
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Publication number: 20240096961Abstract: A contact stack of a semiconductor device includes a source/drain feature, a silicide layer wrapping around the source/drain feature, a seed metal layer in direct contact with the silicide layer, and a conductor in contact with the seed metal layer. The contact stack excludes a metal nitride layer in direct contact with the silicide layer.Type: ApplicationFiled: November 28, 2023Publication date: March 21, 2024Inventors: Shih-Chuan CHIU, Tien-Lu LIN, Yu-Ming LIN, Chia-Hao CHANG, Chih-Hao WANG, Jia-Chuan YOU
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Patent number: 9557046Abstract: A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.Type: GrantFiled: April 8, 2013Date of Patent: January 31, 2017Assignee: EPISTAR CORPORATIONInventors: Chih-Hsuan Sun, Wei-Yu Yeh, Tien-Ming Lin
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Patent number: 9373758Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: GrantFiled: April 25, 2014Date of Patent: June 21, 2016Assignee: EPISTAR CORPORATIONInventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Patent number: 9105818Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.Type: GrantFiled: June 3, 2014Date of Patent: August 11, 2015Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Ming Lin
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Patent number: 9074738Abstract: A lamp includes a substrate, a plurality of light-emitting devices located over the substrate, and a cap that is located over the light-emitting devices. The plurality of light-emitting devices include a first subset of light-emitting devices and a second subset of light-emitting devices. Each light-emitting device in the first subset is free of a phosphor coating. Each light-emitting device in the second subset includes a phosphor coating. The cap has both photo-conversion properties and light-scattering properties, and the cap is located over the first subset of the light-emitting devices but exposes the second subset of the light-emitting devices.Type: GrantFiled: May 8, 2014Date of Patent: July 7, 2015Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Sheng-Shin Guo, Chih-Hsuan Sun, Tien-Ming Lin, Wei-Yu Yeh
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Patent number: 9024341Abstract: Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.Type: GrantFiled: October 27, 2010Date of Patent: May 5, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsiao-Wen Lee, Shang-Yu Tsai, Tien-Ming Lin, Chyi Shyuan Chern, Hsin-Hsien Wu, Fu-Wen Liu, Huai-En Lai, Yu-Sheng Tang
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Patent number: 8999770Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.Type: GrantFiled: July 24, 2013Date of Patent: April 7, 2015Assignee: TSMC Solid State Lighting Ltd.Inventors: Tien-Ming Lin, Chih-Hsuan Sun, Wei-Yu Yeh
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Patent number: 8860056Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: GrantFiled: December 1, 2011Date of Patent: October 14, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Publication number: 20140264268Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.Type: ApplicationFiled: June 3, 2014Publication date: September 18, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Ming Lin
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Patent number: 8835202Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: GrantFiled: December 26, 2013Date of Patent: September 16, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Publication number: 20140240957Abstract: The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.Type: ApplicationFiled: May 8, 2014Publication date: August 28, 2014Inventors: Sheng-Shin Guo, Chih-Hsuan Sun, Tien-Ming Lin, Wei-Yu Yeh
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Publication number: 20140231836Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: ApplicationFiled: April 25, 2014Publication date: August 21, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Patent number: 8765500Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.Type: GrantFiled: August 24, 2012Date of Patent: July 1, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Ming Lin
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Patent number: 8721097Abstract: The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.Type: GrantFiled: May 19, 2011Date of Patent: May 13, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sheng-Shin Guo, Chih-Hsuan Sun, Tien-Ming Lin, Wei-Yu Yeh
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Publication number: 20140106488Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: ApplicationFiled: December 26, 2013Publication date: April 17, 2014Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Publication number: 20140054616Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.Type: ApplicationFiled: August 24, 2012Publication date: February 27, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Ming Lin
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Publication number: 20130309790Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.Type: ApplicationFiled: July 24, 2013Publication date: November 21, 2013Inventors: Tien-Ming Lin, Chih-Hsuan Sun, Wei-Yu Yeh
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Publication number: 20130299855Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.Type: ApplicationFiled: July 15, 2013Publication date: November 14, 2013Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hain-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
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Patent number: 8507328Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.Type: GrantFiled: May 27, 2011Date of Patent: August 13, 2013Assignee: TSMC Solid State Lighting Ltd.Inventors: Tien-Ming Lin, Chih-Hsuan Sun, Wei-Yu Yeh