Patents by Inventor Tien-Ting CHEN

Tien-Ting CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140328719
    Abstract: A lead-free solder composition includes: 3 wt % to 5 wt % of Ag, 0.2 wt % to 0.8 wt % of Cu, 1 wt % to 7 wt % of Bi, 0.005 wt % to 0.06 wt % of Ni, 0.005 wt % to 0.02 wt % of Ge, and the balance being Sn based on 100 wt % of the lead-free solder composition.
    Type: Application
    Filed: October 21, 2013
    Publication date: November 6, 2014
    Applicant: ACCURUS SCIENTIFIC CO., LTD.
    Inventor: Tien-Ting Chen
  • Publication number: 20140134042
    Abstract: A silver-free and lead-free solder composition includes: 2 wt % to 8 wt % of Bi, 0.1 wt % to 1.0 wt % of Cu, 0.01 wt % to 0.2 wt % of at least one of Ni, Fe, and Co, and the balance of Sn based on 100 wt % of the silver-free and lead-free solder composition.
    Type: Application
    Filed: August 26, 2013
    Publication date: May 15, 2014
    Applicant: ACCURUS SCIENTIFIC CO., LTD.
    Inventor: Tien-Ting Chen
  • Publication number: 20120073284
    Abstract: A hot zone heat transfer structure of a Stirling engine is provided. One end of a cylinder includes a heated head, with its end wall connected with a hot air pipe. The cylinder accommodates a piston. The piston has an end surface corresponding to the end wall, between which a hot zone is defined. The end wall is fitted with a protruding heat conductor towards the piston, and the end surface is fitted with a concave heat-conducting portion, enabling normal overlapping of the ends of both the heat conductor and the heat-conducting portion. The overlapping may vary with the changing locations of the piston. A flanged section is set externally onto said heat conductor towards the exterior of the end wall. The heat from the head can be transferred to the central area of the hot zone via the help of the heat conductor and heat-conducting portion.
    Type: Application
    Filed: March 15, 2011
    Publication date: March 29, 2012
    Applicant: MARKETECH INTERNATIONAL CORP.
    Inventors: Tien-Ting CHEN, Chung-Ping Liu, Yin-Nan Huang, Po-Hung Chen, Yu-Ling Huang, Han-Hsun Yang, Ching-Hsiang Cheng