Abstract: A preheating control system comprising a testing device and a processor is provided in present disclosure. The testing device is configured to perform a wafer testing on a wafer lot and perform a device preheating on the testing device. The processor is coupled to the testing device and comprises a timing circuit and a controlling circuit. The timing circuit is configured to calculate a lot-changing time, wherein the lot-changing time is a difference between a time corresponding to removal of a previous wafer lot from the testing device and a time corresponding to insertion of the wafer lot into the testing device. The controlling circuit is configured to control the testing device to perform the wafer testing, and configured to control the testing device to perform the device preheating according to the lot-changing time and a standard lot-changing time.

Abstract: A frequency-locked circuit for a variable frequency topology is configured to trigger a Pulse Width Modulation (PWM) controller to lock a frequency of a driving signal outputted by the PWM controller. The frequency-locked circuit includes an AC wave generating circuit and a comparator. The AC wave generating circuit receives and converts the driving signal to generate an AC wave signal. The comparator is electrically connected to the AC wave generating circuit and receives the AC wave signal. The comparator compares the AC wave signal with a reference signal to generate a comparison output signal. In response to determining that the AC wave signal is greater than the reference signal, the comparison output signal triggers the PWM controller to convert the driving signal from one voltage level to another voltage level so as to lock the frequency. The one voltage level is different from the another voltage level.

Abstract: A wafer test system includes a probe apparatus, a data server, an automation subsystem, and a probe mark assessment subsystem. The probe apparatus includes a probe card, a tester, and a camera. The probe card includes probe pins for contacting test pads in the wafer, and the camera captures an image of the test pads. The automation subsystem obtains an image specification from the probe apparatus and triggers an automated assessment of a probe mark in the image of the test pads. The probe mark assessment subsystem performs the automated assessment of the probe mark in the image of the test pads. The probe mark assessment subsystem performs an image-processing operation to obtain a probe mark assessment result, and the automation subsystem stops the probe apparatus if the probe mark assessment result indicates a probe test failure.

Abstract: A synchronous control method for boxing punching bag is provided. The method includes the following steps: disposing a coach punching bag; sensing a boxing movement from a coach by the plurality of IoT sensors and converting punching positions of the boxing movement into punching position information, which is sent to a data processing device; disposing a plurality of student punching bags; and connecting the plurality of student punching bags to the data processing device, receiving the punching position information synchronously, and converting the punching position information into a light control signal, so as to control the plurality of display lights synchronously to allow a plurality of students to punch the corresponding punching practice zones according to positions of the display lights.

Abstract: The present disclosure provides a wafer test system and methods thereof. The test system includes a probe apparatus, a data server, an automation subsystem, and a probe mark assessment subsystem. The probe apparatus includes a probe card, a tester, and a camera. The probe card includes probe pins for contacting test pads in the wafer, and the camera captures an image of the test pads. The automation subsystem obtains an image specification from the probe apparatus and triggers an automated assessment of a probe mark in the image of the test pads. The probe mark assessment subsystem performs the automated assessment of the probe mark in the image of the test pads. The probe mark assessment subsystem performs an image-processing operation to obtain a probe mark assessment result, and the automation subsystem stops the probe apparatus if the probe mark assessment result indicates a probe test failure.

Abstract: A light-emitting diode light string includes a plurality of lighting modules serially connected to an electric wire. Each lighting module includes a dual-color light emitting diode that serves as a light source of the light string and is removably covered with a facetted shade providing enhanced diffusion and refraction capacity. The light module may be quickly detachably connected to the electric wire through engagement of two corresponding terminals with each other. The dual-color light emitting diode and the facetted shade enable production of changeful and colorful flashes and creation of a unique decorating effect.