Abstract: The present disclosure describes a method to a metallization process with improved gap fill properties. The method includes forming a contact opening in a dielectric layer to expose a source/drain epitaxial layer in a substrate. An aspect ratio of the contact opening is between about 3 and about 10. The method further includes forming a first metal layer in the contact opening and in contact with the source/drain epitaxial layer, forming a barrier layer on the first metal layer, forming a liner layer on the barrier layer, forming second metal layer on the liner layer to partially fill the contact opening, and forming a third metal layer on the second metal layer to fill the contact opening.

Abstract: In an embodiment, a device includes: a first semiconductor nanostructure; a second semiconductor nanostructure adjacent the first semiconductor nanostructure; a first source/drain region on a first sidewall of the first semiconductor nanostructure; a second source/drain region on a second sidewall of the second semiconductor nanostructure, the second source/drain region completely separated from the first source/drain region; and a source/drain contact between the first source/drain region and the second source/drain region.

Abstract: A method of manufacturing a plastic biochip or a biosensor test strip, which is compatible with standard CD/DVD making processes. The method includes substrate injection press molding, followed by seamless magnetic biosensor sputtering. If necessary, the sputtered biosensor is cut off from the substrate.

Abstract: A substrate is provided, and a surface treating process is performed on the surface of the substrate. Then, a plurality of photo resist patterns are formed on the substrate, and a flow process is performed so that each photo resist pattern has a microlens surface. Finally, a metal layer is formed on the photo resist patterns so that the bottom surface of the metal layer has a plurality of patterns complementary to the photo resist patterns.

Abstract: First, a substrate is provided, and a half-tone mask is employed to perform an exposing and developing process for forming a plurality of photoresist patterns having different thickness. Then, a flow process is performed to heat the photoresist patterns so that each photoresist pattern has a microlens surface. Following that, a metal plate is formed on the substrate for obtaining a plurality of patterns, which are opposite to the plurality of photoresist patterns, on the bottom surface. Finally, the metal plate is removed from the substrate, and combined with an insert mold.

Abstract: First, a substrate is provided and a photoresist layer is coated thereon. Then, a film having a pattern is used as a mask to perform an exposing and developing process for patterning the photoresist layer. Following that, LIGA technology is employed to form a thin film having a pattern corresponding to the pattern of the film.

Abstract: A method of fabricating a stamper with microstructure patterns includes providing a substrate, forming a first patterned layer on the substrate, forming a second patterned layer on the substrate for defining an edge of the stamper, and performing an electroforming process by taking the second pattern layer as a growth stop wall so as to form the stamper.

Abstract: An optical data storage medium includes a first substrate, the first substrate including a plurality of first data structures; a second substrate positioned above the first substrate, the second substrate including a plurality of second data structures; a reflective layer positioned on the second substrate to cover the second data structures; and a masking layer interposed between the reflective layer and the first substrate to cover the first data structures, the masking layer having a varying reflectivity to thereby render the second data structures unreadable.