Patents by Inventor Tien Yu Huang
Tien Yu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12172333Abstract: A utility knife includes a shell; a swingable lever pivoted to the shell and protrusive outside the shell; a blade carrier with a notch, slidably disposed in the shell; a linkage mechanism with linkages rotatably connected to one another, two of the linkages rotatably connected to the shell and the blade carrier, respectively; an elastic recovery mechanism connected with the blade carrier and the shell; and a safety member with a projection, movably disposed on the shell. When the projection is located within the notch, the blade carrier is blocked by the projection and non-movable relative to the shell. When the projection is located out of the notch and the linkage mechanism is driven by the swingable lever to push the blade carrier, the blade carrier is movable relative to the shell.Type: GrantFiled: August 8, 2022Date of Patent: December 24, 2024Assignee: ORANGE HARDWARE COMPANYInventor: Tien-Yu Huang
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Publication number: 20240418932Abstract: A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.Type: ApplicationFiled: July 29, 2024Publication date: December 19, 2024Inventors: Kuan-Yu Huang, Tien-Yu Huang, Yu-Yun Huang, Sen-Bor Jan, Sung-Hui Huang, Shang-Yun Hou
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Patent number: 12124078Abstract: A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.Type: GrantFiled: December 13, 2021Date of Patent: October 22, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Kuan-Yu Huang, Yu-Yun Huang, Tien-Yu Huang, Sung-Hui Huang, Sen-Bor Jan, Shang-Yun Hou
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Publication number: 20240237951Abstract: Various examples are provided for accurate heart rate measurement. In one example, a method includes determining respiration displacement from radar-measured cardiorespiratory motion data; adjusting notch depths of a data filter based upon the respiration displacement; and identifying a heart rate from data filtered by the data filter. In another example, a system includes a computing device that can determine a respiration displacement from radar-measured cardiorespiratory motion data; wherein the computing device can adjust a data filter based upon the respiration displacement; and can identify a heart rate based on data filtered by the data filter.Type: ApplicationFiled: March 18, 2024Publication date: July 18, 2024Inventors: Jenshan Lin, Linda Frances Hayward, Tien-yu Huang
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Publication number: 20240042631Abstract: A utility knife is provided, including: a shell; a swingable lever, pivoted to the shell and protrusive outside the shell; a blade carrier, slidably disposed in the shell, including a notch; a linkage mechanism, including a plurality of linkages rotatably connected to one another, two of the plurality of linkages rotatably connected to the shell and the blade carrier, respectively; an elastic recovery mechanism, connected with the blade carrier and the shell; and a safety member, movably disposed on the shell, including a projection; wherein when the projection is located within the notch, the blade carrier is blocked by the projection and non-movable relative to the shell; when the projection is located out of the notch and the linkage mechanism is driven by the swingable lever to push the blade carrier, the blade carrier is movable relative to the shell to project out from the shell.Type: ApplicationFiled: August 8, 2022Publication date: February 8, 2024Inventor: Tien-Yu Huang
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Patent number: 11764123Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.Type: GrantFiled: July 4, 2022Date of Patent: September 19, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
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Patent number: 11694939Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.Type: GrantFiled: May 22, 2020Date of Patent: July 4, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
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Publication number: 20220365274Abstract: A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.Type: ApplicationFiled: December 13, 2021Publication date: November 17, 2022Inventors: Kuan-Yu HUANG, Yu-Yun HUANG, Tien-Yu HUANG, Sung-Hui HUANG, Sen-Bor JAN, Shang-Yun HOU
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Publication number: 20220336309Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.Type: ApplicationFiled: July 4, 2022Publication date: October 20, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
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Patent number: 11243353Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.Type: GrantFiled: December 26, 2019Date of Patent: February 8, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ying-Hao Kuo, Tien-Yu Huang
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Publication number: 20210366802Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.Type: ApplicationFiled: May 22, 2020Publication date: November 25, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
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Patent number: 11150404Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: GrantFiled: August 16, 2019Date of Patent: October 19, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
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Patent number: 10748825Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad disposed over a first substrate and a second conductive pad disposed over a second substrate. The second conductive pad is a multi-layer structure having an uppermost metal layer including titanium or nickel. A molding structure surrounds the first substrate and the second substrate. A conductive structure is over the first substrate and the second substrate. The conductive structure is conductively coupled to the second conductive pad.Type: GrantFiled: April 12, 2019Date of Patent: August 18, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee
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Publication number: 20200132932Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.Type: ApplicationFiled: December 26, 2019Publication date: April 30, 2020Inventors: Ying-Hao Kuo, Tien-Yu Huang
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Patent number: 10527791Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.Type: GrantFiled: May 27, 2016Date of Patent: January 7, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ying-Hao Kuo, Tien-Yu Huang
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Publication number: 20190369329Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: ApplicationFiled: August 16, 2019Publication date: December 5, 2019Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
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Patent number: 10459159Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: GrantFiled: April 22, 2019Date of Patent: October 29, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
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Publication number: 20190250327Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: ApplicationFiled: April 22, 2019Publication date: August 15, 2019Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
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Publication number: 20190237379Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad disposed over a first substrate and a second conductive pad disposed over a second substrate. The second conductive pad is a multi-layer structure having an uppermost metal layer including titanium or nickel. A molding structure surrounds the first substrate and the second substrate. A conductive structure is over the first substrate and the second substrate. The conductive structure is conductively coupled to the second conductive pad.Type: ApplicationFiled: April 12, 2019Publication date: August 1, 2019Inventors: Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee
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Patent number: 10276471Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad over a first chip and a second conductive pad over a second chip. A molding structure surrounds the first chip and the second chip. A first passivation layer is over the first chip and the second chip, and a conductive structure is over the first passivation layer. The conductive structure is coupled to the first conductive pad. A second passivation layer is over the conductive structure. The first passivation layer and the second passivation layer have sidewalls defining an aperture that is directly over an optical element within the second chip and that extends through the first passivation layer and the second passivation layer.Type: GrantFiled: December 27, 2017Date of Patent: April 30, 2019Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee