Patents by Inventor Tien Yu Huang

Tien Yu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12172333
    Abstract: A utility knife includes a shell; a swingable lever pivoted to the shell and protrusive outside the shell; a blade carrier with a notch, slidably disposed in the shell; a linkage mechanism with linkages rotatably connected to one another, two of the linkages rotatably connected to the shell and the blade carrier, respectively; an elastic recovery mechanism connected with the blade carrier and the shell; and a safety member with a projection, movably disposed on the shell. When the projection is located within the notch, the blade carrier is blocked by the projection and non-movable relative to the shell. When the projection is located out of the notch and the linkage mechanism is driven by the swingable lever to push the blade carrier, the blade carrier is movable relative to the shell.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: December 24, 2024
    Assignee: ORANGE HARDWARE COMPANY
    Inventor: Tien-Yu Huang
  • Publication number: 20240418932
    Abstract: A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.
    Type: Application
    Filed: July 29, 2024
    Publication date: December 19, 2024
    Inventors: Kuan-Yu Huang, Tien-Yu Huang, Yu-Yun Huang, Sen-Bor Jan, Sung-Hui Huang, Shang-Yun Hou
  • Patent number: 12124078
    Abstract: A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: October 22, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Kuan-Yu Huang, Yu-Yun Huang, Tien-Yu Huang, Sung-Hui Huang, Sen-Bor Jan, Shang-Yun Hou
  • Publication number: 20240237951
    Abstract: Various examples are provided for accurate heart rate measurement. In one example, a method includes determining respiration displacement from radar-measured cardiorespiratory motion data; adjusting notch depths of a data filter based upon the respiration displacement; and identifying a heart rate from data filtered by the data filter. In another example, a system includes a computing device that can determine a respiration displacement from radar-measured cardiorespiratory motion data; wherein the computing device can adjust a data filter based upon the respiration displacement; and can identify a heart rate based on data filtered by the data filter.
    Type: Application
    Filed: March 18, 2024
    Publication date: July 18, 2024
    Inventors: Jenshan Lin, Linda Frances Hayward, Tien-yu Huang
  • Publication number: 20240042631
    Abstract: A utility knife is provided, including: a shell; a swingable lever, pivoted to the shell and protrusive outside the shell; a blade carrier, slidably disposed in the shell, including a notch; a linkage mechanism, including a plurality of linkages rotatably connected to one another, two of the plurality of linkages rotatably connected to the shell and the blade carrier, respectively; an elastic recovery mechanism, connected with the blade carrier and the shell; and a safety member, movably disposed on the shell, including a projection; wherein when the projection is located within the notch, the blade carrier is blocked by the projection and non-movable relative to the shell; when the projection is located out of the notch and the linkage mechanism is driven by the swingable lever to push the blade carrier, the blade carrier is movable relative to the shell to project out from the shell.
    Type: Application
    Filed: August 8, 2022
    Publication date: February 8, 2024
    Inventor: Tien-Yu Huang
  • Patent number: 11764123
    Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.
    Type: Grant
    Filed: July 4, 2022
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
  • Patent number: 11694939
    Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: July 4, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
  • Publication number: 20220365274
    Abstract: A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.
    Type: Application
    Filed: December 13, 2021
    Publication date: November 17, 2022
    Inventors: Kuan-Yu HUANG, Yu-Yun HUANG, Tien-Yu HUANG, Sung-Hui HUANG, Sen-Bor JAN, Shang-Yun HOU
  • Publication number: 20220336309
    Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.
    Type: Application
    Filed: July 4, 2022
    Publication date: October 20, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
  • Patent number: 11243353
    Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: February 8, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Hao Kuo, Tien-Yu Huang
  • Publication number: 20210366802
    Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.
    Type: Application
    Filed: May 22, 2020
    Publication date: November 25, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
  • Patent number: 11150404
    Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: October 19, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
  • Patent number: 10748825
    Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad disposed over a first substrate and a second conductive pad disposed over a second substrate. The second conductive pad is a multi-layer structure having an uppermost metal layer including titanium or nickel. A molding structure surrounds the first substrate and the second substrate. A conductive structure is over the first substrate and the second substrate. The conductive structure is conductively coupled to the second conductive pad.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: August 18, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee
  • Publication number: 20200132932
    Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.
    Type: Application
    Filed: December 26, 2019
    Publication date: April 30, 2020
    Inventors: Ying-Hao Kuo, Tien-Yu Huang
  • Patent number: 10527791
    Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: January 7, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Hao Kuo, Tien-Yu Huang
  • Publication number: 20190369329
    Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.
    Type: Application
    Filed: August 16, 2019
    Publication date: December 5, 2019
    Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
  • Patent number: 10459159
    Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: October 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
  • Publication number: 20190250327
    Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
  • Publication number: 20190237379
    Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad disposed over a first substrate and a second conductive pad disposed over a second substrate. The second conductive pad is a multi-layer structure having an uppermost metal layer including titanium or nickel. A molding structure surrounds the first substrate and the second substrate. A conductive structure is over the first substrate and the second substrate. The conductive structure is conductively coupled to the second conductive pad.
    Type: Application
    Filed: April 12, 2019
    Publication date: August 1, 2019
    Inventors: Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee
  • Patent number: 10276471
    Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad over a first chip and a second conductive pad over a second chip. A molding structure surrounds the first chip and the second chip. A first passivation layer is over the first chip and the second chip, and a conductive structure is over the first passivation layer. The conductive structure is coupled to the first conductive pad. A second passivation layer is over the conductive structure. The first passivation layer and the second passivation layer have sidewalls defining an aperture that is directly over an optical element within the second chip and that extends through the first passivation layer and the second passivation layer.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee