Patents by Inventor Tien Yu Huang
Tien Yu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11939268Abstract: A method of forming low-k material is provided. The method includes providing a plurality of core-shell particles. The core of the core-shell particles has a first ceramic with a low melting point. The shell of the core-shell particles has a second ceramic with a low melting point and a low dielectric constant. The core-shell particles are sintered and molded to form a low-k material. The shell of the core-shell particles is connected to form a network structure of a microcrystal phase.Type: GrantFiled: December 23, 2020Date of Patent: March 26, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuo-Chuang Chiu, Tzu-Yu Liu, Tien-Heng Huang, Tzu-Chi Chou, Cheng-Ting Lin
-
Publication number: 20240042631Abstract: A utility knife is provided, including: a shell; a swingable lever, pivoted to the shell and protrusive outside the shell; a blade carrier, slidably disposed in the shell, including a notch; a linkage mechanism, including a plurality of linkages rotatably connected to one another, two of the plurality of linkages rotatably connected to the shell and the blade carrier, respectively; an elastic recovery mechanism, connected with the blade carrier and the shell; and a safety member, movably disposed on the shell, including a projection; wherein when the projection is located within the notch, the blade carrier is blocked by the projection and non-movable relative to the shell; when the projection is located out of the notch and the linkage mechanism is driven by the swingable lever to push the blade carrier, the blade carrier is movable relative to the shell to project out from the shell.Type: ApplicationFiled: August 8, 2022Publication date: February 8, 2024Inventor: Tien-Yu Huang
-
Patent number: 11764123Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.Type: GrantFiled: July 4, 2022Date of Patent: September 19, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
-
Patent number: 11694939Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.Type: GrantFiled: May 22, 2020Date of Patent: July 4, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
-
Publication number: 20220365274Abstract: A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.Type: ApplicationFiled: December 13, 2021Publication date: November 17, 2022Inventors: Kuan-Yu HUANG, Yu-Yun HUANG, Tien-Yu HUANG, Sung-Hui HUANG, Sen-Bor JAN, Shang-Yun HOU
-
Publication number: 20220336309Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.Type: ApplicationFiled: July 4, 2022Publication date: October 20, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
-
Patent number: 11243353Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.Type: GrantFiled: December 26, 2019Date of Patent: February 8, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ying-Hao Kuo, Tien-Yu Huang
-
Publication number: 20210366802Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.Type: ApplicationFiled: May 22, 2020Publication date: November 25, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
-
Patent number: 11150404Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: GrantFiled: August 16, 2019Date of Patent: October 19, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
-
Patent number: 10748825Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad disposed over a first substrate and a second conductive pad disposed over a second substrate. The second conductive pad is a multi-layer structure having an uppermost metal layer including titanium or nickel. A molding structure surrounds the first substrate and the second substrate. A conductive structure is over the first substrate and the second substrate. The conductive structure is conductively coupled to the second conductive pad.Type: GrantFiled: April 12, 2019Date of Patent: August 18, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee
-
Publication number: 20200132932Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.Type: ApplicationFiled: December 26, 2019Publication date: April 30, 2020Inventors: Ying-Hao Kuo, Tien-Yu Huang
-
Patent number: 10527791Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.Type: GrantFiled: May 27, 2016Date of Patent: January 7, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ying-Hao Kuo, Tien-Yu Huang
-
Publication number: 20190369329Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: ApplicationFiled: August 16, 2019Publication date: December 5, 2019Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
-
Patent number: 10459159Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: GrantFiled: April 22, 2019Date of Patent: October 29, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
-
Publication number: 20190250327Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: ApplicationFiled: April 22, 2019Publication date: August 15, 2019Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
-
Publication number: 20190237379Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad disposed over a first substrate and a second conductive pad disposed over a second substrate. The second conductive pad is a multi-layer structure having an uppermost metal layer including titanium or nickel. A molding structure surrounds the first substrate and the second substrate. A conductive structure is over the first substrate and the second substrate. The conductive structure is conductively coupled to the second conductive pad.Type: ApplicationFiled: April 12, 2019Publication date: August 1, 2019Inventors: Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee
-
Patent number: 10276471Abstract: In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad over a first chip and a second conductive pad over a second chip. A molding structure surrounds the first chip and the second chip. A first passivation layer is over the first chip and the second chip, and a conductive structure is over the first passivation layer. The conductive structure is coupled to the first conductive pad. A second passivation layer is over the conductive structure. The first passivation layer and the second passivation layer have sidewalls defining an aperture that is directly over an optical element within the second chip and that extends through the first passivation layer and the second passivation layer.Type: GrantFiled: December 27, 2017Date of Patent: April 30, 2019Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee
-
Patent number: 10267988Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: GrantFiled: October 5, 2017Date of Patent: April 23, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin
-
Patent number: 10245736Abstract: A cutter includes a handle, a cassette and a sliding element. The handle includes a slot in an end and two grooves in two opposite internal faces. The cassette includes two bosses and a catch. The bosses are inserted in the grooves to allow the cassette to translate and pivot. The catch is formed on the cassette. The sliding element includes a fin, and is movable in the handle between a rear position and a front position. In the rear position, the fin is separated from the catch and the cassette is far from the slot. In the front position, the fin is in contact with the catch and the cassette is located near the slot. The catch is abutted against the fin so that the cassette is moved forward in the handle while the sliding element is moved to the front position from the rear position.Type: GrantFiled: April 28, 2017Date of Patent: April 2, 2019Assignee: ORANGE HARDWARE COMPANYInventor: Tien-Yu Huang
-
Publication number: 20190004247Abstract: A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.Type: ApplicationFiled: October 5, 2017Publication date: January 3, 2019Inventors: Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin