Patents by Inventor Tien Yue Wu

Tien Yue Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protective cover plate for flip chip assembly backside
    Patent number: 6403882
    Abstract: A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low Young's modulus of elasticity may be 10,000 psi or less; 1,000 psi or less; or, preferably, about 1,000 psi. Further, the adhesive may include a thermal conducting material. A protective plate is coupled to the inactive surface using the adhesive and a chip carrier is coupled to the active surface of the die.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: June 11, 2002
    Assignee: International Business Machines Corporation
    Inventors: William Tze-You Chen, Michael Anthony Gaynes, Eric Arthur Johnson, Tien Yue Wu
  • Integrated circuit package
    Patent number: 6226187
    Abstract: The bond strength between a semiconductor chip and a metal heat sink in an integrated circuit package can be improved by using an adhesive system comprising two separate layers, one layer exhibiting preferential bonding strength for the chip and the other layer exhibiting preferential bonding strength for the metal heat sink.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: May 1, 2001
    Assignee: International Business Machines Corporation
    Inventors: David Lee Questad, Anne Marie Quinn, George Henry Thiel, Donna Jean Trevitt, Tien Yue Wu, Patrick Robert Zippetelli
  • Integrated circuit package including a heat sink and an adhesive
    Patent number: 6084299
    Abstract: The bond strength between a semiconductor chip and a metal heat sink in an integrated circuit package can be improved by using an adhesive system comprising two separate layers, one layer exhibiting preferential bonding strength for the chip and the other layer exhibiting preferential bonding strength for the metal heat sink.
    Type: Grant
    Filed: November 9, 1995
    Date of Patent: July 4, 2000
    Assignee: International Business Machines Corporation
    Inventors: David Lee Questad, Anne Marie Quinn, George Henry Thiel, Donna Jean Trevitt, Tien Yue Wu, Patrick Robert Zippetelli