Patents by Inventor Ties Ramcke

Ties Ramcke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6614069
    Abstract: A nonvolatile semiconductor memory cell includes a transistor component formed on a substrate and a storage node that determines the switching state of the transistor component. The storage node is arranged near a control gate electrode. The storage node has a group of vertically oriented column structures having at least two semiconductor layer zones and an insulating layer zone situated between the two semiconductor layer zones.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: September 2, 2003
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Rösner, Thomas Schulz, Lothar Risch, Ties Ramcke
  • Patent number: 6490190
    Abstract: A memory cell configuration has word lines and bit lines that extend transversely with respect thereto. Memory elements with a giant magnetoresistive effect are respectively connected between one of the word lines and one of the bit lines. The bit lines are each connected to a sense amplifier by means of which the potential on the respective bit line can be regulated to a reference potential and at which an output signal can be picked off. The memory cell configuration can be used both as an MRAM and as an associative memory.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: December 3, 2002
    Assignee: Infineon Technologies AG
    Inventors: Ties Ramcke, Wolfgang Rösner, Lothar Risch
  • Publication number: 20020125525
    Abstract: A nonvolatile semiconductor memory cell includes a transistor component formed on a substrate and a storage node that determines the switching state of the transistor component. The storage node is arranged near a control gate electrode. The storage node has a group of vertically oriented column structures having at least two semiconductor layer zones and an insulating layer zone situated between the two semiconductor layer zones.
    Type: Application
    Filed: January 22, 2002
    Publication date: September 12, 2002
    Inventors: Wolfgang Rosner, Thomas Schulz, Lothar Risch, Ties Ramcke
  • Patent number: 6442042
    Abstract: At least one CMOS component which is configured in a semiconductor substrate is part of the inventive circuit assembly. An insulating layer is configured on the semiconductor substrate. The insulating layer covers the CMOS component. A nanoelectronic component is configured above the insulating layer. At least one conducting structure is configured in the insulating layer and serves to link the nanoelectronic component with the CMOS component. If several nanoelectronic components are provided, they are preferably grouped to nano-circuit blocks. Each of the nano-circuit blocks is so small that the RC times of their lines do not exceed 1 ns.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: August 27, 2002
    Assignee: Infineon Technologies AG
    Inventors: Ties Ramcke, Lothar Risch, Wolfgang Rösner
  • Patent number: 6417043
    Abstract: Resistors are connected between word lines and bit lines running transversely with respect thereto. The resistors have a higher resistance than the word lines and the bit lines. The bit lines are each connected to a sense amplifier which regulates the potential on the respective bit line to a reference potential and at which an output signal can be picked off. If one of the word lines is selected and all the other word lines are put at reference potential, then the resistance of the resistor, which is assigned to an information item, can be read from the output signal.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: July 9, 2002
    Assignee: Infineon Technologies AG
    Inventors: Lothar Risch, Wolfgang Rösner, Ties Ramcke, Hermann Jacobs
  • Publication number: 20010055201
    Abstract: At least one CMOS component which is configured in a semiconductor substrate is part of the inventive circuit assembly. An insulating layer is configured on the semiconductor substrate. The insulating layer covers the CMOS component. A nanoelectronic component is configured above the insulating layer. At least one conducting structure is configured in the insulating layer and serves to link the nanoelectronic component with the CMOS component. If several nanoelectronic components are provided, they are preferably grouped to nano-circuit blocks. Each of the nano-circuit blocks is so small that the RC times of their lines do not exceed 1 ns.
    Type: Application
    Filed: June 18, 2001
    Publication date: December 27, 2001
    Inventors: Ties Ramcke, Lothar Risch, Wolfgang Rosner
  • Patent number: 6320447
    Abstract: The circuit configuration has at least five single-electron transistors, three of which are connected via a second main node and a third main node between a first main node and an output. The fourth single-electron transistor is connected between the second main node and a first supply voltage, with its gate electrode being connected to the first main node. The fifth single-electron transistor is connected between the third main node and the first supply voltage, with its gate electrode being connected to the second main node. The circuit configuration is suitable for use as a full adder and as a multiplier.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: November 20, 2001
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Rösner, Ties Ramcke, Lothar Risch
  • Patent number: 6307422
    Abstract: At least one single-electron transistor is provided in a circuit configuration having single-electron components, and is connected between a first main node and a second main node. The first main node is capacitively connected between a first operating voltage connection and a second operating voltage connection. The gate electrode of the single-electron transistor is connected to a control voltage connection. The circuit configuration is suitable for logic operations on binary numbers, whose digits are stored at the first and second main nodes.
    Type: Grant
    Filed: March 1, 2000
    Date of Patent: October 23, 2001
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Roesner, Ties Ramcke, Lothar Risch