Patents by Inventor Tieshu Huang

Tieshu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical connectors including glass seals and methods of fabrication
    Patent number: 11909157
    Abstract: An electrical connector comprises an outer shell, at least one pin, and an insulating seal. The outer shell includes at least one side wall defining a cavity and having an inner surface. The outer shell is formed from electrically conductive material. The pin is positioned within the cavity and is also formed from electrically conductive material. The insulating seal is configured to provide electrical isolation of the pin and fills the cavity between the inner surface of the side wall and the pin. The insulating seal is formed from glass doped with a transition metal oxide.
    Type: Grant
    Filed: December 7, 2021
    Date of Patent: February 20, 2024
    Assignee: Honeywell Federal Manufacturing & Technologies, LLC
    Inventors: Dennis J. Eichorst, Tieshu Huang, Kaley M. McLain, Richard K. Brow
  • ELECTRICAL CONNECTORS INCLUDING GLASS SEALS AND METHODS OF FABRICATION
    Publication number: 20230178950
    Abstract: An electrical connector comprises an outer shell, at least one pin, and an insulating seal. The outer shell includes at least one side wall defining a cavity and having an inner surface. The outer shell is formed from electrically conductive material. The pin is positioned within the cavity and is also formed from electrically conductive material. The insulating seal is configured to provide electrical isolation of the pin and fills the cavity between the inner surface of the side wall and the pin. The insulating seal is formed from glass doped with a transition metal oxide.
    Type: Application
    Filed: December 7, 2021
    Publication date: June 8, 2023
    Applicant: Honeywell Federal Manufacturing & Technologies, LLC
    Inventors: Dennis J. Eichorst, Tieshu Huang, Kaley M. McLain, Richard K. Brow
  • Method for fabricating biocompatible porous titanium
    Patent number: 9481036
    Abstract: A method for fabricating porous metal constructs (such as porous Ti constructs) which may be used as implants in bone repair is disclosed. The method employs a new saltbath sintering process coupled with conventional powder metallurgy technology which is capable of fabricating porous metal constructs with controlled porosity and pore size having a lower production cost than conventional powder metallurgy methods.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: November 1, 2016
    Assignee: The Curators of the University of Missouri
    Inventors: B. Sonny Bal, Tieshu Huang, Mohamed N. Rahaman
  • METHOD FOR FABRICATING BIOCOMPATIBLE POROUS TITANIUM
    Publication number: 20140348688
    Abstract: A method for fabricating porous metal constructs (such as porous Ti constructs) which may be used as implants in bone repair is disclosed. The method employs a new saltbath sintering process coupled with conventional powder metallurgy technology which is capable of fabricating porous metal constructs with controlled porosity and pore size having a lower production cost than conventional powder metallurgy methods.
    Type: Application
    Filed: December 10, 2012
    Publication date: November 27, 2014
    Inventors: B. Sonny Bal, Tieshu Huang, Mohamed N. Rahaman