Abstract: The present invention provides a system for wet processing a wafer which includes a processing chamber, in which the wafer is processed, and a means for supporting and rotating the wafer about an upright axis within the processing chamber. A nozzle through which a flow of fluid is directed onto the wafer is positioned downwardly over the wafer. The nozzle includes a nozzle housing in communication with a fluid supply and at least two tubes forming angled extensions from the nozzle housing. Each tube has an inner end and an outer end and directs a fluid flow from the inner end through the outer end to a predetermined location on the wafer while the wafer is rotated within the processing chamber. The inner end of each tube has an angled opening larger than the diameter of the inner end of each tube and the diameter of the outer end of each the tube is larger than the diameter of the inner end which reduces the fluid pressure and increases the fluid flow rate.